Virtual Metrology for 3D Vertical Stacking Processes in Semiconductor Manufacturing

被引：0
|
作者：
Wu, Syue-Ren [1 ]
Chen, Chun-Fu [1 ]
Luoh, Tuung [1 ]
Yang, Ling-Wuu [1 ]
Yang, Tahone [1 ]
Chen, Kuang-Chao [1 ]
机构：
[1] Macronix Int Co LTD, Technol Dev Ctr, 19 Li Hsin Rd,Sci Pk, Hsinchu, Taiwan
来源：
2016 E-MANUFACTURING AND DESIGN COLLABORATION SYMPOSIUM (EMDC) | 2016年
关键词：
FDC; 3D NAND; Virtual Metrology; Linear Regression;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页数：3
相关论文
共 50 条
  • [1] STRUCTURED REGULARIZATION MODELING FOR VIRTUAL METROLOGY IN SEMICONDUCTOR MANUFACTURING PROCESSES
    Park, Chanhee
    Park, Sung Ho
    Kim, Seoung Bum
    [J]. INTERNATIONAL JOURNAL OF INDUSTRIAL ENGINEERING-THEORY APPLICATIONS AND PRACTICE, 2019, 26 (06): : 835 - 849
  • [2] A virtual metrology system for semiconductor manufacturing
    Kang, Pilsung
    Lee, Hyoung-joo
    Cho, Sungzoon
    Kim, Dongil
    Park, Jinwoo
    Park, Chan-Kyoo
    Doh, Seungyong
    [J]. EXPERT SYSTEMS WITH APPLICATIONS, 2009, 36 (10) : 12554 - 12561
  • [3] Virtual metrology technique for semiconductor manufacturing
    Chang, Yaw-Jen
    Kang, Yuan
    Hsu, Chih-Liang
    Chang, Chi-Tim
    Chan, Tat Yan
    [J]. 2006 IEEE INTERNATIONAL JOINT CONFERENCE ON NEURAL NETWORK PROCEEDINGS, VOLS 1-10, 2006, : 5289 - 5293
  • [4] Integrated metrology and processes for semiconductor manufacturing
    Ho, WK
    Tay, A
    Lim, KW
    Loh, AP
    Tan, WW
    [J]. IECON 2005: THIRTY-FIRST ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETY, VOLS 1-3, 2005, : 2278 - 2283
  • [5] Metrology and Inspection Rquirements for 3D Stacking of ICs
    Halder, Sandip
    Miller, Andy
    Maenhoudt, Mireille
    Beyer, Gerald
    Swinnen, Bart
    Beyne, Eric
    Grant, David
    Marx, David
    Dudley, Russ
    Ford, Maurice
    [J]. 2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 615 - 618
  • [6] Multitask learning for virtual metrology in semiconductor manufacturing systems
    Park, Chanhee
    Kim, Younghoon
    Park, Youngjoon
    Kim, Seoung Bum
    [J]. COMPUTERS & INDUSTRIAL ENGINEERING, 2018, 123 : 209 - 219
  • [7] Virtual metrology for semiconductor manufacturing: Focus on transfer learning
    Clain, Rebecca
    Borodin, Valeria
    Juge, Michel
    Roussy, Agnes
    [J]. 2021 IEEE 17TH INTERNATIONAL CONFERENCE ON AUTOMATION SCIENCE AND ENGINEERING (CASE), 2021, : 1621 - 1626
  • [8] A Sampling Decision System for Virtual Metrology in Semiconductor Manufacturing
    Kurz, Daniel
    De Luca, Cristina
    Pilz, Juergen
    [J]. IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, 2015, 12 (01) : 75 - 83
  • [9] Hyperspectral Imaging Reflectometry for 3D Semiconductor Metrology
    Kim, Jinseob
    Park, Gwangsik
    Han, Daehoon
    Kim, Wookrae
    Lee, Myungjun
    [J]. 2021 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO), 2021,
  • [10] Virtual metrology and feedback control for semiconductor manufacturing processes using recursive partial least squares
    Khan, Aftab A.
    Moyne, J. R.
    Tilbury, D. M.
    [J]. JOURNAL OF PROCESS CONTROL, 2008, 18 (10) : 961 - 974
12345