Virtual Metrology for 3D Vertical Stacking Processes in Semiconductor Manufacturing

被引：0
|
作者：
Wu, Syue-Ren [1 ]
Chen, Chun-Fu [1 ]
Luoh, Tuung [1 ]
Yang, Ling-Wuu [1 ]
Yang, Tahone [1 ]
Chen, Kuang-Chao [1 ]
机构：
[1] Macronix Int Co LTD, Technol Dev Ctr, 19 Li Hsin Rd,Sci Pk, Hsinchu, Taiwan
来源：
2016 E-MANUFACTURING AND DESIGN COLLABORATION SYMPOSIUM (EMDC) | 2016年
关键词：
FDC; 3D NAND; Virtual Metrology; Linear Regression;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页数：3
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