Finite element contact analysis on a horn-holder assembly for wire bonding

被引:3
|
作者
Jang, CS [1 ]
Ahn, GS [1 ]
Kim, YJ [1 ]
Kwak, DO [1 ]
Booh, SW [1 ]
Kim, JO [1 ]
机构
[1] Samsung Techwin Co Ltd, Precis Instrument R&D Ctr, Sungnam 462121, South Korea
关键词
design of computations; finite element contact analysis; horn-holder assembly; ultrasonic transducer horn; wire bonding;
D O I
10.1109/TEPM.2003.812999
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The joint structure of a transducer horn-holder assembly for a wire bonder was examined through finite element contact analysis. Three-dimensional modeling and analysis was carried out to survey the internal physics of this structure and to verify the accuracy of a proposed computation relative to measurement. After validation, a two-dimensional, model was built to conduct parametric studies and improve the efficiency and speed of the computation. Several factors such as boundary conditions, modeling boundary, and mesh density, were considered to obtain consistency with the three-dimensional analysis. Arc angle and the position of each holder boss were chosen as design parameters. A designed computation approach was applied for efficiency in computation. As a result, a guideline for holder boss design was suggested, and the main factors and their influence on stress concentration in the transducer horn were surveyed.
引用
收藏
页码:46 / 53
页数:8
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