Finite Element analysis of wire clamp for wire bonding

Wire clamp is used in the wire bonding process to grip and release the gold wire for forming loop profile in 1-2 milliseconds. Large opening and high response frequency are the mainly two factors for wire clamp design. To research the feature of wire clamp, a finite-element model was developed to calculate the amplification ratio and nature frequency. Results show that piezoelectric actuated wire clamp has a high resonant frequency of over 1000 Hz and an opening of over 80 mu m. The effect of geometry parameters on the amplification ratio was also studied based on the finite-element model, and length of arm was found as the major factor. This research is useful for wire clamp design and optimization.