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- [33] A New Integration Technology Platform: Integrated Fan-Out Wafer-Level-Packaging for Mobile Applications 2015 SYMPOSIUM ON VLSI TECHNOLOGY (VLSI TECHNOLOGY), 2015,
- [34] High Gain and Low Profile Magnetic Current Array Antenna on Fan-out Wafer Level Packaging 2021 IEEE MTT-S INTERNATIONAL MICROWAVE WORKSHOP SERIES ON ADVANCED MATERIALS AND PROCESSES FOR RF AND THZ APPLICATIONS (IMWS-AMP), 2021, : 409 - 411
- [35] Broadband Fan-Out Phased Antenna Array at 28GHz for 5G Applications 2020 50TH EUROPEAN MICROWAVE CONFERENCE (EUMC), 2020,
- [36] Broadband Fan-Out Phased Antenna Array at 28GHz for 5G Applications 2020 50TH EUROPEAN MICROWAVE CONFERENCE (EUMC), 2020,
- [37] Characterization of Electromigration Effects in RDL of Wafer Level Fan-In and Fan-Out Packaging Using a Novel Analysis Approach 2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2018,
- [39] Fan-in/Fan-out for Heterogeneous 19-core Fibers Based on Metasurfaces with Nonuniform Phase Plates 2023 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION, OFC, 2023,