共 50 条
- [23] BURIED COAXIAL CONDUCTORS FOR HIGH-SPEED INTERCONNECTIONS [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (02): : 204 - 208
- [24] MODELING AND SIMULATION OF INTERCONNECTIONS IN HIGH-SPEED PACKAGES [J]. PROCEEDING OF THE TECHNICAL PROGRAM OF NEPCON WEST 89, VOLS 1 AND 2, 1989, : 698 - 707
- [25] Crosstalk Analysis and Optimization of High-Speed Interconnections [J]. 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 964 - 967
- [26] Electrical characterization methods for high-speed interconnections [J]. International Journal of Microcircuits and Electronic Packaging, 1995, 18 (03): : 207 - 216
- [27] WDM based high-speed optical dual-bus LAN [J]. APPLICATIONS OF PHOTONIC TECHNOLOGY 4: CLOSING THE GAP BETWEEN THEORY, DEVELOPMENT, AND APPLICATION, 2000, 4087 : 130 - 135
- [28] 1.6 Gb/s/pin 4-PAM signaling and circuits for a multi-drop bus [J]. 2000 SYMPOSIUM ON VLSI CIRCUITS, DIGEST OF TECHNICAL PAPERS, 2000, : 128 - 131
- [30] THE HIGH-SPEED BUS SYSTEM FOR LISA [J]. NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 1990, 293 (1-2): : 33 - 35