Analysis of lossy multi-CHIP module interconnections using finite element method

被引：1
|
作者：
Kolbehdari, MA [1 ]
Sadiku, MNO [1 ]
机构：
[1] TEMPLE UNIV,DEPT ELECT ENGN,PHILADELPHIA,PA 19120
来源：
PROCEEDINGS OF THE IEEE SOUTHEASTCON '96: BRINGING TOGETHER EDUCATION, SCIENCE AND TECHNOLOGY | 1996年
关键词：
D O I：
10.1109/SECON.1996.510045
中图分类号：
TP31 [计算机软件];
学科分类号：
081202 ; 0835 ;
摘要：
引用
收藏
页码：144 / 147
页数：2
相关论文
共 50 条
  • [41] Microring-based multi-chip WDM photonic module
    Shubin, Ivan
    Zheng, Xuezhe
    Thacker, Hiren
    Djordjevic, Stevan S.
    Lin, Shiyun
    Amberg, Philip
    Yao, Jin
    Lexau, Jon
    Chang, Eric
    Liu, Frankie
    Park, Namseok
    Raj, Kannan
    Ho, Ron
    Cunningham, John E.
    Krishnamoorthy, Ashok V.
    OPTICS EXPRESS, 2015, 23 (10): : 13172 - 13184
  • [42] Special issue on multi-chip module testing and design for testability
    Agrawal, VD
    JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 1997, 10 (1-2): : 5 - 5
  • [43] High Density Multi-Chip Module for Photonic Reservoir Computing
    Heroux, Jean Benoit
    Yamane, Toshiyuki
    Numata, Hidetoshi
    Nakano, Daiju
    IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 231 - 236
  • [44] Package embedded heat exchanger for stacked multi-chip module
    Lee, H
    Jeong, Y
    Shin, J
    Baek, J
    Kang, MK
    Chun, KJ
    SENSORS AND ACTUATORS A-PHYSICAL, 2004, 114 (2-3) : 204 - 211
  • [45] Incorporating Multi-Chip Module packaging constraints into system design
    Garg, V
    Lacy, S
    Schimmel, DE
    Stogner, D
    Ulmer, C
    Wills, DS
    Yalamanchili, S
    EUROPEAN DESIGN & TEST CONFERENCE 1996 - ED&TC 96, PROCEEDINGS, 1996, : 508 - 513
  • [46] Thermal Design of a LED Multi-chip Module for Automotive Headlights
    Qi Lin
    Wang Chunqing
    Tian Yanhong
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 1435 - 1438
  • [47] Integral microwave circulators for multi-chip module (MCM) applications
    Krishnamurthy, V
    Whitmore, B
    Paik, K
    1997 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS I-III: HIGH FREQUENCIES IN HIGH PLACES, 1997, : 1829 - 1832
  • [48] Design, fabrication, and characterization of electrical and fluidic interconnections for a multi-chip microelectroflumic bench
    Do Suk, S
    Chang, S
    Cho, YH
    MEMS 2005 Miami: Technical Digest, 2005, : 658 - 661
  • [49] Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm
    Tang, Hong-Yu
    Ye, Huai-Yu
    Chen, Xian-Ping
    Qian, Cheng
    Fan, Xue-Jun
    Zhang, Guo-Qi
    IEEE ACCESS, 2017, 5 : 16459 - 16468
  • [50] Thermal Measurement Method for Multi-Chip Packages
    Tat, Goo Fu
    Meng, Lee Han
    Peng, Gee Kok
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 131 - 136
12345