Analysis of lossy multi-CHIP module interconnections using finite element method

被引：1
|
作者：
Kolbehdari, MA [1 ]
Sadiku, MNO [1 ]
机构：
[1] TEMPLE UNIV,DEPT ELECT ENGN,PHILADELPHIA,PA 19120
来源：
PROCEEDINGS OF THE IEEE SOUTHEASTCON '96: BRINGING TOGETHER EDUCATION, SCIENCE AND TECHNOLOGY | 1996年
关键词：
D O I：
10.1109/SECON.1996.510045
中图分类号：
TP31 [计算机软件];
学科分类号：
081202 ; 0835 ;
摘要：
引用
收藏
页码：144 / 147
页数：2
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