Finite element analysis of plastic-encapsulated Multi-Chip Packages

被引：0
|
作者：
Natl Univ of Singapore, Singapore, Singapore [1 ]
机构：
来源：
Proceedings of the Electronic Packaging Technology Conference, EPTC | 1998年
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：170 / 176
相关论文
共 50 条
  • [1] Finite element analysis of plastic-encapsulated Multi-Chip Packages
    Tay, AAO
    Ong, SH
    Lee, LW
    2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, : 170 - 176
  • [2] MILITARY STANDARDIZATION OF PLASTIC-ENCAPSULATED IC PACKAGES
    NGUYEN, LT
    JACKSON, JA
    SOLID STATE TECHNOLOGY, 1993, 36 (08) : 39 - &
  • [3] Thermal analysis of multi-chip LED packages
    Kim, Lan
    Choi, Jonghwa
    Jang, Sunho
    Shin, Moo Whan
    ADVANCED LEDS FOR SOLID STATE LIGHTING, 2006, 6355
  • [4] Dependence of fracture strength of plastic-encapsulated packages on temperature
    Lee, Seong Min
    JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, 2007, 45 (07): : 429 - 433
  • [5] PowerPC multi-chip packages
    不详
    AMERICAN CERAMIC SOCIETY BULLETIN, 2003, 82 (03): : 19 - 19
  • [6] Finite Element simulation for three dimensional thermal analysis of Multi-Chip Module
    Ping, Yang
    Qin, Xiangnan
    Shen, Caijun
    Liao, Ningbo
    INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY, 2009, 34 (03): : 241 - 250
  • [7] Analysis of lossy multi-CHIP module interconnections using finite element method
    Kolbehdari, MA
    Sadiku, MNO
    PROCEEDINGS OF THE IEEE SOUTHEASTCON '96: BRINGING TOGETHER EDUCATION, SCIENCE AND TECHNOLOGY, 1996, : 144 - 147
  • [8] Filler-induced failure mechanism in plastic-encapsulated microelectronic packages
    Seong-Min Lee
    Metals and Materials International, 2006, 12 : 513 - 516
  • [9] Filler-induced failure mechanism in plastic-encapsulated microelectronic packages
    Lee, Seong-Min
    METALS AND MATERIALS INTERNATIONAL, 2006, 12 (06) : 513 - 516
  • [10] Thermal Measurement Method for Multi-Chip Packages
    Tat, Goo Fu
    Meng, Lee Han
    Peng, Gee Kok
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 131 - 136
12345