Self-aligned TiSi2/Si heteronanocrystal nonvolatile memory

被引:32
|
作者
Zhu, Y [1 ]
Zhao, DT [1 ]
Li, RG [1 ]
Liu, JL [1 ]
机构
[1] Univ Calif Riverside, Dept Elect Engn, Quantum Struct Lab, Riverside, CA 92521 USA
关键词
D O I
10.1063/1.2183815
中图分类号
O59 [应用物理学];
学科分类号
摘要
The titanium silicide/silicon (TiSi2/Si) heteronanocrystals are fabricated on SiO2 thin films. The metal-oxide-semiconductor structure embedding the TiSi2/Si heteronanocrystals shows superior performance over the Si dot device. The charge loss rate in the TiSi2/Si heteronanocrystal device is 7.5 times less than that of the Si dot device. It is also found that the TiSi2/Si heteronanocrystal device has wider memory window than the Si dot counterpart. (c) 2006 American Institute of Physics.
引用
收藏
页数:3
相关论文
共 50 条
  • [31] Agglomeration resistant self-aligned silicide process using N2 implantation into TiSi2
    Nishiyama, A
    Akasaka, Y
    Ushiku, Y
    Hishioka, K
    Suizu, Y
    Shiozaki, M
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1997, 36 (6A): : 3639 - 3643
  • [32] NOVEL SELF-ALIGNED W/TIN/TISI2 CONTACT STRUCTURE FOR VERY SHALLOW JUNCTIONS AND INTERCONNECTIONS
    JOSHI, RV
    MOY, D
    BRODSKY, S
    CHARAI, A
    KRUSINELBAUM, L
    RESTLE, PJ
    NGUYEN, TN
    OH, CS
    APPLIED PHYSICS LETTERS, 1989, 54 (17) : 1672 - 1674
  • [33] HREM OF TISI2/SI AND TISI2/SIO2 INTERFACES
    VASILIEV, AL
    KISELEV, NA
    LEBEDEV, OI
    ORLOVA, EV
    VASILIEV, AG
    ORLIKOVSKY, AA
    INSTITUTE OF PHYSICS CONFERENCE SERIES, 1991, (117): : 297 - 302
  • [34] PROCESS LIMITATION AND DEVICE DESIGN TRADEOFFS OF SELF-ALIGNED TISI2 JUNCTION FORMATION IN SUBMICROMETER CMOS DEVICES
    LU, CY
    SUNG, JMJ
    LIU, R
    TSAI, NS
    SINGH, R
    HILLENIUS, SJ
    KIRSCH, HC
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1991, 38 (02) : 246 - 254
  • [35] DSA-TYPE NONVOLATILE MEMORY TRANSISTOR WITH SELF-ALIGNED GATES
    KIKUCHI, M
    OHYA, S
    YAMAGISHI, M
    JAPANESE JOURNAL OF APPLIED PHYSICS, 1978, 17 : 49 - 54
  • [36] Crystallographic structures and parasitic resistances of self-aligned silicide TiSi2/self-aligned nitrided barrier layer/selective chemical vapor deposited aluminum in fully self-aligned metallization metal oxide semiconductor field-effect transistor
    Lee, CH
    Nishimura, T
    Matsuhashi, H
    Yokoyama, M
    Masu, K
    Tsubouchi, K
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 1999, 38 (10): : 5835 - 5838
  • [37] Self-aligned silicides for ohmic contacts in complementary metal-oxide-semiconductor technology:: TiSi2, CoSi2 and NiSi
    Zhang, SL
    Smith, U
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2004, 22 (04): : 1361 - 1370
  • [38] Crystallographic structures and parasitic resistances of self-aligned silicide TiSi2/self-aligned nitrided barrier layer/selective chemical vapor deposited aluminum in fully self-aligned metallization metal oxide semiconductor field-effect transistor
    Lee, Chang-Hun
    Nishimura, Takamasa
    Matsuhashi, Hideki
    Yokoyama, Michio
    Masu, Kazuya
    Tsubouchi, Kazuo
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1999, 38 (10): : 5835 - 5838
  • [39] Self-Aligned Formation of Nanoscale Phase Change Materials for Nonvolatile Memory Application
    Lee, Seung-Yun
    Jung, Soun
    Yoon, Sung-Min
    Park, Young Sam
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2011, 50 (06)
  • [40] COMPARISON OF SELF ALIGNED SILICIDE TECHNOLOGIES BASED ON COSI2 AND TISI2
    VANDENHOVE, L
    WOLTERS, R
    MAEX, K
    DEKEERSMAECKER, R
    DECLERCK, G
    VIDE-SCIENCE TECHNIQUE ET APPLICATIONS, 1987, 42 (236): : 111 - 113