SOI Technologies from Microelectronics to Microsystems - Meeting the More than Moore Roadmap Requirements -

被引:0
|
作者
Raskin, Jean-Pierre [1 ]
机构
[1] Catholic Univ Louvain, Inst Informat & Commun Technol Elect & Appl Math, B-1348 Louvain, Belgium
来源
2012 IEEE 11TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT-2012) | 2012年
关键词
RF PERFORMANCE; RESISTIVITY; SENSORS;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This last decade Silicon-on-Insulator (SOI) MOSFET technology has demonstrated its potentialities for high frequency (reaching cut-off frequencies close to 500 GHz for nMOSFETs) and for harsh environments (high temperature, radiation) commercial applications. SOI also presents high resistivity substrate capabilities, leading to substantially reduced substrate losses. More recently, SOI technology has been emerging as a major contender for heterogeneous microsystems applications. In this work, we demonstrate the advantages of SOI technology for RF CMOS integration as well as for building thin film sensors on thin dielectric membrane and three-dimensional micro-electro-mechanical (MEMS) sensors and actuators co-integrated with their associated SOI CMOS circuitry.
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页码:144 / 147
页数:4