High-Performance High-K/Metal Planar Self-Aligned Gate-All-Around CMOS Devices

被引:9
|
作者
Pouydebasque, Arnaud [1 ,3 ]
Denorme, Stephane [2 ]
Loubet, Nicolas [2 ]
Wacquez, Romain [2 ]
Bustos, Jessy [2 ]
Leverd, Francois [2 ]
Deloffre, Emilie [2 ]
Barnola, Sebastien [3 ]
Dutartre, Didier [2 ]
Coronel, Philippe [2 ]
Skotnicki, Thomas [2 ]
机构
[1] NXP Semicond, F-38926 Crolles, France
[2] ST Microelect, F-38926 Crolles, France
[3] French Atom Energy Commiss CEA LETI, Elect & Informat Technol Lab, F-38054 Grenoble, France
关键词
Double-gate device; gate-all-around (GAA) device; ring oscillator (RO); MOSFET;
D O I
10.1109/TNANO.2008.2002981
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
By introducing high-K dielectrics and metal gate in our planar self-aligned gate-all-round (GAA) fabrication process, we have successfully fabricated sub-35 nm CMOS devices that exhibit high-performance drive currents (2230/1000 mu A/mu m for N/P at V-d = 1.2 V), low OFF-state currents (315 nA/mu m), and excellent subthreshold characteristics. When benchmarked with other published multigate data, the results presented in this paper are proved to be among the best and underline the potential of planar self-aligned GAA devices for the 32 nm technology and below. In particular, it is demonstrated that an optimized supply voltage can bring a significant improvement in circuit time delay and power when using GAA devices.
引用
收藏
页码:551 / 557
页数:7
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