Applications of Focused Ion Beam Technology in Bonding Failure Analysis for Microelectronic Devices

被引：2
|
作者：
Chen, Yuan [1 ]
Zhang, Xiaowen [1 ]
机构：
[1] 110 Dongguanzhuang Rd, Guangzhou, Guangdong, Peoples R China
来源：
INFORMATION TECHNOLOGY FOR MANUFACTURING SYSTEMS II, PTS 1-3 | 2011年 / 58-60卷
关键词：
Focused Ion Beam; Microelectronic Device; Failure Analysis; Bonding Failure;
D O I：
10.4028/www.scientific.net/AMM.58-60.2171
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
Focused ion beam (FIB) system is a powerful microfabrication tool which uses electronic lenses to focus the ion beam even up to nanometer level. The FIB technology has become one of the most necessary failure analysis and failure mechanism study tools for microelectronic device in the past several years. Bonding failure is one of the most common failure mechanisms for microelectronic devices. But because of the invisibility of the bonding interface, it is difficult to analyze this kind of failure. The paper introduced the basic principles of FIB technology. And two cases for microelectronic devices bonding failure were analyzed successfully by FIB technology in this paper.
引用
收藏
页码：2171 / +
页数：2
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