Guest Editorial Introduction to the Special Issue on the 2022 IEEE International Solid-State Circuits Conference (ISSCC)

被引：0
|
作者：
Wu, Wanghua [1 ]
Ito, Hiroyuki [2 ]
Anders, Jens [3 ]
Ali, Ahmed M. A. [4 ]
Pillonnet, Gael [5 ]
机构：
[1] Samsung Semicond, San Jose, CA 95134 USA
[2] Tokyo Inst Technol, Inst Innovat Res, Yokohama, Kanagawa 2268503, Japan
[3] Univ Stuttgart, Inst Smart Sensors & IMS CHIPS, D-70569 Stuttgart, Germany
[4] Apple, Cupertino, CA 95014 USA
[5] Univ Grenoble Alpes, CEA Leti, F-38000 Grenoble, France
来源：
IEEE JOURNAL OF SOLID-STATE CIRCUITS | 2022年 / 57卷 / 12期
关键词：
D O I：
10.1109/JSSC.2022.3212205
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：3509 / 3513
页数：5
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