Guest Editorial Introduction to the Special Issue on the 2022 IEEE International Solid-State Circuits Conference (ISSCC)

被引：0

作者：

Wu, Wanghua ^{[1
]}

Ito, Hiroyuki ^{[2
]}

Anders, Jens ^{[3
]}

Ali, Ahmed M. A. ^{[4
]}

Pillonnet, Gael ^{[5
]}

机构：

[1] Samsung Semicond, San Jose, CA 95134 USA

[2] Tokyo Inst Technol, Inst Innovat Res, Yokohama, Kanagawa 2268503, Japan

[3] Univ Stuttgart, Inst Smart Sensors & IMS CHIPS, D-70569 Stuttgart, Germany

[4] Apple, Cupertino, CA 95014 USA

[5] Univ Grenoble Alpes, CEA Leti, F-38000 Grenoble, France

来源：

IEEE JOURNAL OF SOLID-STATE CIRCUITS | 2022年 / 57卷 / 12期

关键词：

D O I：

10.1109/JSSC.2022.3212205

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：3509 / 3513

页数：5

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