Guest Editorial Introduction to the Special Issue on the 2021 IEEE International Solid-State Circuits Conference (ISSCC)

被引：0
|
作者：
Chiu, Yun [1 ]
Law, Man-Kay [2 ]
Krishnapura, Nagendra [3 ]
Stauth, Jason T. [4 ]
Walling, Jeffrey S. [5 ]
机构：
[1] Univ Texas Dallas, Dept Elect & Comp Engn, Richardson, TX 75080 USA
[2] Univ Macau, State Key Lab Analog & Mixed Signal VLSI, Taipa, Macau, Peoples R China
[3] Indian Inst Technol Madras, Dept Elect Engn, Chennai 600036, Tamil Nadu, India
[4] Dartmouth Coll, Thayer Sch Engn, Hanover, NH 03755 USA
[5] Virginia Tech, Bradley Dept Elect & Comp Engn, Blacksburg, VA 24061 USA
来源：
IEEE JOURNAL OF SOLID-STATE CIRCUITS | 2021年 / 56卷 / 12期
关键词：
D O I：
10.1109/JSSC.2021.3121154
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：3547 / 3550
页数：4
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