A Numerical Model of a Reciprocating-Mechanism Driven Heat Loop for Two-Phase High Heat Flux Cooling

被引:3
|
作者
Popoola, Olubunmi [1 ]
Bamgbade, Ayobami [1 ]
Cao, Yiding [1 ]
机构
[1] Florida Int Univ, Dept Mech & Mat Engn, Miami, FL 33174 USA
关键词
heat loop; reciprocating flow; high heat flux; two-phase flow; FLOW; COEFFICIENT; DYNAMICS; VELOCITY;
D O I
10.1115/1.4034059
中图分类号
O414.1 [热力学];
学科分类号
摘要
An effective design option for a cooling system is to use a two-phase pumped cooling loop to simultaneously satisfy the temperature uniformity and high heat flux requirements. A reciprocating-mechanism driven heat loop (RMDHL) is a novel heat transfer device that could attain a high heat transfer rate through a reciprocating flow of the two-phase working fluid inside the heat transfer device. Although the device has been tested and validated experimentally, analytical or numerical study has not been undertaken to understand its working mechanism and provide guidance for the device design. The objective of this paper is to develop a numerical model for the RMDHL to predict its operational performance under different working conditions. The developed numerical model has been successfully validated by the existing experimental data and will provide a powerful tool for the design and performance optimization of future RMDHLs. The study also reveals that the maximum velocity in the flow occurs near the wall rather than at the center of the pipe, as in the case of unidirectional steady flow. This higher velocity near the wall may help to explain the enhanced heat transfer of an RMDHL.
引用
收藏
页数:12
相关论文
共 50 条
  • [1] EVALUATION OF TURBULENCE MODELS FOR THE NUMERICAL STUDY OF RECIPROCATING-MECHANISM DRIVEN HEAT LOOP
    Popoola, Olubunmi T.
    Bamgbade, Ayobami A.
    Cao, Y.
    PROCEEDINGS OF THE ASME FLUIDS ENGINEERING DIVISION SUMMER MEETING, 2016, VOL 1B, 2016,
  • [2] Experimental study of a bellows-type reciprocating-mechanism driven heat loop
    Cao, Yiding
    Xu, Dehao
    Gao, Mingcong
    INTERNATIONAL JOURNAL OF ENERGY RESEARCH, 2013, 37 (06) : 665 - 672
  • [3] A TWO-PHASE HEAT SPREADER FOR COOLING HIGH HEAT FLUX SOURCES
    Hashimoto, Mitsuo
    Kasai, Hiroto
    Ishida, Yuichi
    Ryoson, Hiroyuki
    Yazawa, Kazuaki
    Weibel, Justin A.
    Garimella, Suresh V.
    2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 2010,
  • [4] High heat flux two-phase cooling in silicon multimicrochannels
    Agostini, Bruno
    Thome, John Richard
    Fabbri, Matteo
    Michel, Bruno
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2008, 31 (03): : 691 - 701
  • [5] Experimental study on the boiling heat transfer characteristics of a pump-driven two-phase cooling loop system for high heat flux avionics
    Wang, Jiaxuan
    Yu, Binbin
    Qian, Chenyi
    Shi, Junye
    Chen, Jiangping
    THERMAL SCIENCE AND ENGINEERING PROGRESS, 2023, 45
  • [6] PASSIVE TWO-PHASE THERMOSYPHON LOOP COOLING SYSTEM FOR HIGH-HEAT-FLUX SERVERS
    Lamaison, N.
    Marcinichen, J. B.
    Szczukiewicz, S.
    Thome, J. R.
    Beucher, P.
    INTERFACIAL PHENOMENA AND HEAT TRANSFER, 2015, 3 (04) : 369 - 391
  • [7] Experimental and analytical studies of reciprocating-mechanism driven heat loops (RMDHLs)
    Cao, Yiding
    Gao, Mingcong
    JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2008, 130 (07):
  • [8] Constructal design of two-phase stacked microchannel heat exchangers for cooling at high heat flux
    Ariyo, David O.
    Bello-Ochende, Tunde
    International Communications in Heat and Mass Transfer, 2021, 125
  • [9] Constructal design of two-phase stacked microchannel heat exchangers for cooling at high heat flux
    Ariyo, David O.
    Bello-Ochende, Tunde
    INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2021, 125
  • [10] DIRECT-TO-CHIP TWO-PHASE COOLING FOR HIGH HEAT FLUX PROCESSORS
    Heydari, Ali
    Manaserh, Yaman
    Abubakar, Ahmad
    Caceres, Carol
    Miyamura, Harold
    Ortega, Alfonso
    Rodriguez, Jeremy
    PROCEEDINGS OF ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2022, 2022,