A Numerical Model of a Reciprocating-Mechanism Driven Heat Loop for Two-Phase High Heat Flux Cooling

被引:3
|
作者
Popoola, Olubunmi [1 ]
Bamgbade, Ayobami [1 ]
Cao, Yiding [1 ]
机构
[1] Florida Int Univ, Dept Mech & Mat Engn, Miami, FL 33174 USA
关键词
heat loop; reciprocating flow; high heat flux; two-phase flow; FLOW; COEFFICIENT; DYNAMICS; VELOCITY;
D O I
10.1115/1.4034059
中图分类号
O414.1 [热力学];
学科分类号
摘要
An effective design option for a cooling system is to use a two-phase pumped cooling loop to simultaneously satisfy the temperature uniformity and high heat flux requirements. A reciprocating-mechanism driven heat loop (RMDHL) is a novel heat transfer device that could attain a high heat transfer rate through a reciprocating flow of the two-phase working fluid inside the heat transfer device. Although the device has been tested and validated experimentally, analytical or numerical study has not been undertaken to understand its working mechanism and provide guidance for the device design. The objective of this paper is to develop a numerical model for the RMDHL to predict its operational performance under different working conditions. The developed numerical model has been successfully validated by the existing experimental data and will provide a powerful tool for the design and performance optimization of future RMDHLs. The study also reveals that the maximum velocity in the flow occurs near the wall rather than at the center of the pipe, as in the case of unidirectional steady flow. This higher velocity near the wall may help to explain the enhanced heat transfer of an RMDHL.
引用
收藏
页数:12
相关论文
共 50 条
  • [21] NUMERICAL SIMULATION OF A BELLOWS-TYPE RECIPROCATING MECHANISM-DRIVEN HEAT LOOP (RMDHL)
    Popoola, Olubunmi
    Soleimani, Soheil
    Cao, Yiding
    HEAT TRANSFER RESEARCH, 2017, 48 (09) : 827 - 848
  • [22] High heat flux heat pipe mechanism for cooling of electronics
    Zuo, Z.J.
    North, M.T.
    Wert, K.L.
    Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, 2000, 2 : 122 - 128
  • [23] High heat flux heat pipe mechanism for cooling of electronics
    Zuo, ZJ
    North, MT
    Wert, KL
    ITHERM 2000: SEVENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOL 2, PROCEEDINGS, 2000, : 122 - 128
  • [24] High heat flux heat pipe mechanism for cooling of electronics
    Zuo, ZJ
    North, MT
    Wert, KL
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2001, 24 (02): : 220 - 225
  • [25] High heat flux heat pipe mechanism for cooling of electronics
    2000, Institute of Electrical and Electronics Engineers Inc., Piscataway, NJ, USA (02):
  • [26] High heat flux absorption utilizing porous materials with two-phase heat transfer
    Dickey, JT
    Peterson, GP
    JOURNAL OF ENERGY RESOURCES TECHNOLOGY-TRANSACTIONS OF THE ASME, 1997, 119 (03): : 171 - 178
  • [27] High Heat Flux Two-Phase Cooling of Electronics with Integrated Diamond/Porous Copper Heat Sinks and Microfluidic Coolant Supply
    Palko, James W.
    Lee, Hyoungsoon
    Agonafer, Damena D.
    Zhang, Chi
    Jung, Ki Wook
    Moss, Jess
    Wilbur, Joshua D.
    Dusseault, Tom J.
    Barako, Michael T.
    Houshmand, Farzad
    Rong, Guoguang
    Maitra, Tanmoy
    Gorle, Catherine
    Won, Yoonjin
    Rockosi, Derrick
    Mykyta, Ihor
    Resler, Dan
    Altman, David
    Asheghi, Mehdi
    Santiago, Juan G.
    Goodson, Kenneth E.
    2016 15TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2016, : 1511 - 1517
  • [28] Critical heat flux limiting the effective cooling performance of two-phase cooling with an interlayer microchannel
    Park, Jong-Yoon
    Peng, Lu
    Choi, Jin-Woo
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2019, 25 (07): : 2831 - 2840
  • [29] Critical heat flux limiting the effective cooling performance of two-phase cooling with an interlayer microchannel
    Jong-Yoon Park
    Lu Peng
    Jin-Woo Choi
    Microsystem Technologies, 2019, 25 : 2831 - 2840
  • [30] Numerical simulation on the heat transfer characteristics of two-phase loop thermosyphon with high filling ratios
    Wang, Kuiming
    Hu, Chengzhi
    Jiang, Bo
    Hu, Xianfeng
    Tang, Dawei
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2022, 184