共 50 条
- [1] ELECTRICAL, STRUCTURAL AND PROCESSING PROPERTIES OF ELECTRICALLY CONDUCTIVE ADHESIVES [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (08): : 843 - 851
- [2] The electrical and mechanical properties of electrically conductive adhesives in pin-through-hole applications [J]. JOURNAL OF ELECTRONICS MANUFACTURING, 1996, 6 (03): : 219 - 230
- [3] Effects of reducing agents on the electrical properties of electrically conductive adhesives [J]. IEEE CPMT: INTERNATIONAL SYMPOSIUM AND EXHIBITION ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, 2006, : 179 - +
- [4] Effects of reducing agents on the electrical properties of electrically conductive adhesives [J]. IEEE CPMT: INTERNATIONAL SYMPOSIUM AND EXHIBITION ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, 2006, : 132 - 132
- [5] Correlations Between Mechanical and Electrical Parameters of Modified Electrically Conductive Adhesives [J]. 2011 34TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2011) - NEW TRENDS IN MICRO/NANOTECHNOLOGY, 2011, : 118 - 121
- [7] Electrical and thermomechanical modeling of electrically conductive adhesives [J]. IEEE CPMT: INTERNATIONAL SYMPOSIUM AND EXHIBITION ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, 2006, : 69 - 69
- [9] Environmental aging effects on thermal and mechanical properties of electrically conductive adhesives [J]. JOURNAL OF ADHESION, 2003, 79 (07): : 699 - 723