Electrical and mechanical reliability and failure mechanism analysis of electrically conductive adhesives

被引：1
|
作者：
Zhang, Weiwei [1 ,2 ]
Yao, Zhijun [3 ]
Liu, Hao [1 ,4 ]
Liu, Jiahao [5 ]
Li, Mingyu [1 ,2 ]
Li, Fuquan [6 ]
Chen, Hongtao [1 ,2 ]
机构：
[1] Harbin Inst Technol Shenzhen, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China
[2] Harbin Inst Technol Shenzhen, Sauvage Lab Smart Mat, Shenzhen 518055, Peoples R China
[3] Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China
[4] Beijing Santel Technol & Trading Corp, Beijing 100039, Peoples R China
[5] China Elect Prod Reliabil & Environm Testing Res I, Guangzhou 510610, Peoples R China
[6] Harbin Inst Technol, Dept Mat Sci & Engn, Harbin 150001, Peoples R China
来源：
MICROELECTRONICS RELIABILITY | 2023年 / 151卷
关键词：
Electrically conductive adhesives; Reliability; Failure mechanism; Thermal shock; Thermal aging; MOISTURE; DURABILITY; ALUMINUM; EPOXY; ICA;
D O I：
10.1016/j.microrel.2023.115236
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
For electrically conductive adhesives (ECAs) interconnection, adequate electrical, mechanical and thermal performance are crucial for long-term service reliability. The work focused primarily on analyzing the effects of environmental aging on the reliability and failure mechanism of ECAs joints. In this paper, high temperature and humidity (85 degrees C, 85%RH, 1000 h), thermal shock (-40 degrees C to 125 degrees C, 1000 cycles) and thermal aging (125 degrees C, 1000 h) tests were performed to study the reliability of the ECAs. Additionally, the fracture modes were investigated by mechanical shear strength testing before and after the reliability tests. The interfacial microstructure of the ECAs was investigated and the fracture mechanism of ECAs was characterized. The study showed that the reliability of the ECAs was improved compared with conventional ECA1 and ECA2.
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页数：8
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