PROPERTIES OF MODIFIED ELECTRICALLY CONDUCTIVE ADHESIVES

被引:0
|
作者
Ratislav, Marek [1 ]
Pilarcikova, Ivana [1 ]
Busek, David [1 ]
Mach, Pavel [1 ]
机构
[1] CTU FEE Tech 2, Prague 16627 6, Czech Republic
来源
NANOCON 2011 | 2011年
关键词
electrically conductive adhesives; isotropic conductive adhesives; mechanical and electrical parameters; nonlinearity;
D O I
暂无
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Electrically conductive adhesives - ECAs is one of the options, how to make lead-free environmental interconnections in electrical engineering. This work deals with electrical properties of electrically conductive adhesives. The work first describes the characteristics and composition of isotropic conductive adhesives - ICA and then the possibility of modifications that improve its mechanical and electrical parameters. The aim of this work is the measurement of electrical resistance and nonlinearity of connections created with isotropic conductive adhesives and compare changes in these variables after adjusting adhesives by adding silver nitrate and its subsequent annealing.
引用
收藏
页码:421 / 426
页数:6
相关论文
共 50 条
  • [1] ELECTRICALLY CONDUCTIVE ADHESIVES MODIFIED USING IONS AND NANOPARTICLES
    Busek, David
    Pilarcikova, Ivana
    Mach, Pavel
    NANOCON 2011, 2011, : 397 - 402
  • [2] Adhesion and RF Properties of Electrically Conductive Adhesives
    Moon, K.
    Staiculescu, D.
    Kim, S.
    Liu, Z.
    Chan, H.
    Sundaram, V.
    Tummala, R.
    Wong, C. P.
    2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 1881 - 1884
  • [3] The effect of conductive filler on the properties of electrically conductive adhesives(ECAs)
    Hao, Jian
    Wang, Dapeng
    Li, Saipeng
    He, Xinyue
    Zhou, Jian
    Xue, Feng
    2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 803 - 808
  • [4] Electrically conductive adhesives
    Gordon, Rachel
    Coating International, 2016, 49 (03): : 10 - 11
  • [5] Physical properties and thermocycling performance of electrically conductive adhesives (ECAs) modified by flexible molecules
    Li, HY
    Moon, KS
    Li, Y
    Fan, LH
    Xu, JW
    Wong, CP
    9TH INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, 2004 PROCEEDINGS, 2004, : 45 - 50
  • [6] Preparation of Electrically Conductive Adhesives Modified with AgNO3
    Mach, Pavel
    2009 32ND INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, 2009, : 621 - 624
  • [7] Electrically conductive adhesives filled with surface modified copper particles
    Chen, Wenjun
    Deng, Dunying
    Xiao, Fei
    2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 288 - 291
  • [8] Effect of porous copper on the properties of electrically conductive adhesives
    Ho, Li-Ngee
    Nishikawa, Hiroshi
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2015, 26 (10) : 7771 - 7779
  • [9] Effect of porous copper on the properties of electrically conductive adhesives
    Li-Ngee Ho
    Hiroshi Nishikawa
    Journal of Materials Science: Materials in Electronics, 2015, 26 : 7771 - 7779
  • [10] ELECTRICAL, STRUCTURAL AND PROCESSING PROPERTIES OF ELECTRICALLY CONDUCTIVE ADHESIVES
    LI, L
    LIZZUL, C
    KIM, H
    SACOLICK, I
    MORRIS, JE
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (08): : 843 - 851