DELAMINATION IMPROVEMENT FOR A QFN PACKAGE WITH STACKED DIES BY FINITE ELEMENT SIMULATION

被引：0

作者：

Huang, Weidong ^{[1
]}

Jin, Jian ^{[1
]}

Yang, April ^{[1
]}

Wu, Wei ^{[1
]}

Wu, Jacky ^{[1
]}

Dong, Grass ^{[1
]}

Oo, C. F. ^{[1
]}

机构：

[1] Diodes Shanghai Co LTD, Dept Res & Dev, Shanghai, Peoples R China

来源：

2019 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC) | 2019年

关键词：

D O I：

10.1109/cstic.2019.8755767

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Finite Element Method is applied in this study to explore the solution of delamination improvement for a QFN package. Adding hole into clip design is adopted in DOE test as the corrective action. By this study and others in our practices, the criterion with negative peeling stress proves to be effective for delamination improvement. Further studies and confirmation runs will continue to verify this criterion as general guideline for delamination improvement.

引用

页数：3

共 50 条

[1] Optimization of stacked die design on stacked die QFN package by simulation approach
Bachok, Nur Nadia
Zaharim, Azami
Ahmad, Ibrahim
Talib, Meor Zainal Meor
Ihsan, Ahmad Kamal Ariffin
Kamarudin, Noor Baharin Che
PROCEEDINGS OF THE 9TH WSEAS INTERNATIONAL CONFERENCE ON MATHEMATICAL AND COMPUTATIONAL METHODS IN SCIENCE AND ENGINEERING (MACMESE '07)/ DNCOCO '07, 2007, : 97 - 102
[2] Die Pad Delamination on QFN package
Chiew, Chong Chee
Samsun, Paing
Vigneswaran, Letcheemana
Ang, Amy
2018 IEEE 38TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT), 2018,
[3] Stacked package delamination
Lin, T.Y.
Advanced Packaging, 2003, 12 (02): : 21 - 22
[4] Lead-Frames Copper Oxidation Effect for a QFN Package Delamination Improvement
Shu, Min-Fong
Chen, Koduck
Yang, Bret
Liu, Webber
Tseng, Yi-Hsiu
2016 6TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2016,
[5] Interfacial Delamination Characterization and Thermo-mechanical Reliability of Stacked Die Package by Finite Element Analysis
Chen, Bin
Wang, Hong-Guang
Lyu, Guang-Chao
Yang, Bing-Xian
Hu, Wei-Lin
Zhang, Xin-Ping
2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
[6] The Effect of Etching Lead Frame on QFN Package Delamination
Li, Yun
Li, Tina
2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
[7] Fatigue test method for observing the delamination effect in a QFN package
Abdullah, S.
Abdullah, M. F.
Arifin, A. K.
2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, : 670 - 674
[8] Finite element simulation of delamination process in composite materials
Sabau, Emilia
Vilau, Cristian
Bere, Paul
Popescu, Adrian
MODERN TECHNOLOGIES IN MANUFACTURING (MTEM 2019), 2019, 299
[9] Finite element simulation of delamination with application to crashworthy design
Fleming, David C.
Morrow, Clint
Clarke, Charles W.
Bird, Connie E.
JOURNAL OF THE AMERICAN HELICOPTER SOCIETY, 2008, 53 (03) : 267 - 281
[10] Investigation of Failures on Dual-Dies Stacked Package
Chen, Yi Heng
Lin, W. B.
Huang, Hsien Wei
Hsiao, Meiying
Ko, Chen-Hsien
PROCEEDINGS OF THE 2013 20TH IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2013), 2013, : 603 - 606

← 1 2 3 4 5 →