Stacked package delamination

被引：0
|
作者：
Lin, T.Y.
机构：
来源：
Advanced Packaging | 2003年 / 12卷 / 02期
关键词：
Computer simulation - Consumer electronics - Delamination - Dies - Finite element method - Fracture mechanics - Integrated circuits - Process engineering - Stiffness - Stress concentration - Thermal conductivity - Thermal stress;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
A study was performed on stacked package delamination. The fish bone diagram that helps to identify the possible root causes inducing the delamination was discussed. The material, process and design aspects were evaluated by experiments and finite element analysis.
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页码：21 / 22
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