DELAMINATION IMPROVEMENT FOR A QFN PACKAGE WITH STACKED DIES BY FINITE ELEMENT SIMULATION

被引：0

作者：

Huang, Weidong ^{[1
]}

Jin, Jian ^{[1
]}

Yang, April ^{[1
]}

Wu, Wei ^{[1
]}

Wu, Jacky ^{[1
]}

Dong, Grass ^{[1
]}

Oo, C. F. ^{[1
]}

机构：

[1] Diodes Shanghai Co LTD, Dept Res & Dev, Shanghai, Peoples R China

来源：

2019 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC) | 2019年

关键词：

D O I：

10.1109/cstic.2019.8755767

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Finite Element Method is applied in this study to explore the solution of delamination improvement for a QFN package. Adding hole into clip design is adopted in DOE test as the corrective action. By this study and others in our practices, the criterion with negative peeling stress proves to be effective for delamination improvement. Further studies and confirmation runs will continue to verify this criterion as general guideline for delamination improvement.

引用

页数：3

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