Package aids enclosure design

被引：0
|
作者：
Coates, TJ [1 ]
机构：
[1] PCE Engn, Johnson City, TN USA
来源：
CONTROL ENGINEERING | 1999年 / 46卷 / 08期
关键词：
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：62 / 62
页数：1
相关论文
共 50 条
  • [41] Software aids fast design of gearboxes - Latest version of Romax Designer software includes package specially tailored for the design of wind turbines
    不详
    PROFESSIONAL ENGINEERING, 2008, 21 (11) : 51 - 51
  • [42] Design Advisor for Package-on-Package (PoP) Manufacturing
    Xie, Bin
    Sun, Peng
    Shi, Daniel
    2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 86 - 92
  • [43] Effects of package design on top PoP package warpage
    Zhao, Junfeng
    Luo, Yuxiang
    Huang, Zhenyu
    Ma, Rong
    58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 1082 - 1088
  • [44] An intervention package to increase awareness and change attitudes to AIDS
    Bhogle, S
    Srinath, MM
    INTERNATIONAL JOURNAL OF PSYCHOLOGY, 1996, 31 (3-4) : 24113 - 24113
  • [45] Beautiful ECO-package design - Seven approaches to ECO-package design
    Kaneko, S
    FIRST INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DEGIGN AND INVERSE MANUFACTURING, PROCEEDINGS, 1999, : 444 - 447
  • [46] Design for improvement of drop impact performance of Package-on Package
    Luan, Jing-en
    2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, : 937 - 942
  • [47] Enhanced Package on Package with Coreless Substrate Optimal Design Evaluation
    Lin, Vito
    Liu, Kenet
    Kao, Nicholas
    Jiang, Don Son
    2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
  • [48] USE OF ELECTRONICS IN PACKAGE DESIGN
    GOFF, JW
    IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS AND CONTROL INSTRUMENTATION, 1964, IE11 (01): : 57 - &
  • [49] LOGIC CIRCUIT PACKAGE DESIGN
    GOTO, K
    ITO, Y
    REVIEW OF THE ELECTRICAL COMMUNICATIONS LABORATORIES, 1971, 19 (03): : 357 - +
  • [50] FLOOR POLISH PACKAGE DESIGN
    SNYDER, G
    SOAP AND CHEMICAL SPECIALITIES, 1970, 46 (09): : 89 - &
12345