Surface roughness effect on copper-alumina adhesion

被引：19

作者：

Lim, Ju Dy ^{[1
,2
,3
]}

Susan, Yeow Su Yi ^{[2
]}

Daniel, Rhee MinWoo ^{[1
]}

Leong, Kam Chew ^{[3
]}

Wong, Chee Cheong ^{[2
]}

机构：

[1] ASTAR, Inst Microelect, Singapore, Singapore

[2] Nanyang Technol Univ, Sch Mat Sci & Engn, Singapore 639798, Singapore

[3] GLOBALFOUNDRIES Singapore Pte Ltd, Singapore 738406, Singapore

来源：

MICROELECTRONICS RELIABILITY | 2013年 / 53卷 / 9-11期

关键词：

Alumina; Copper; Bonding strength; Surface roughness; Surface area; IMPROVEMENT; PLASMA;

D O I：

10.1016/j.microrel.2013.07.016

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studied using Atomic Force Microscopy (AFM). With rougher surface, the adhesive strength between a deposited copper film and the alumina substrate is higher due to the larger contact area at the interface. For 99.99% pure copper-96% pure alumina, this effect can account for an adhesive strength increment of more than 50%. (C) 2013 Elsevier Ltd. All rights reserved.

引用

页码：1548 / 1552

页数：5

共 50 条

[41] Synthesis and tribological properties of copper-alumina nanocomposites prepared by coprecipitation technique
Xuelong Fu
Yubing Hu
Jie Tao
Journal of Wuhan University of Technology-Mater. Sci. Ed., 2016, 31 : 1123 - 1130
[42] DISPERSION STRENGTHENED COPPER-ALUMINA ALLOY PRODUCED BY MECHANICAL MIXING METHOD
MATSUDA, Y
TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS, 1968, S 9 : 587 - &
[43] Effect of surface roughness on grain growth and sintering of alumina
Nampi, Padmaja Parameswaran
Kume, Shoichi
Hotta, Yuji
Watari, Koji
BULLETIN OF MATERIALS SCIENCE, 2011, 34 (04) : 799 - 804
[44] Effect of surface roughness on grain growth and sintering of alumina
Nampi P.P.
Kume S.
Hotta Y.
Watari K.
Bulletin of Materials Science, 2011, 34 (4) : 799 - 804
[45] Ab initio study of electronic densities of states at copper-alumina interfaces
Hashibon, Adham
Elsaesser, Christian
Ruehle, Manfred
ACTA MATERIALIA, 2007, 55 (05) : 1657 - 1665
[46] Correlation of Fine Scale Microstructure and Mechanical Properties of Copper-Alumina Nanocomposites
Goswami, R.
Qadri, S. B.
Ryou, H.
METAL-MATRIX COMPOSITES: ADVANCES IN ANALYSIS, MEASUREMENT, AND OBSERVATIONS, 2021, : 133 - 142
[47] Copper-Alumina Capsules for High-Temperature Thermal Energy Storage
Zhao, Bo
Liu, Renjie
Sheng, Nan
Mahmoudi, Yasser
Zhu, Chunyu
ACS APPLIED ENGINEERING MATERIALS, 2023, 1 (05): : 1335 - 1342
[48] Effect of surface roughness on the adhesion of elastomers to hard surfaces
Fuller, Keith
MECHANICAL BEHAVIOUR OF MATERIALS, 2011, 662 : 39 - 51
[49] EFFECT OF SURFACE-ROUGHNESS AND MECHANICAL INTERLOCKING ON ADHESION
GENT, AN
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1990, 199 : 54 - MACRO
[50] Effect of surface roughness of biomaterials on Staphylococcus epidermidis adhesion
Itaru Yoda
Hironobu Koseki
Masato Tomita
Takayuki Shida
Hidehiko Horiuchi
Hideyuki Sakoda
Makoto Osaki
BMC Microbiology, 14

← 1 2 3 4 5 →