Surface roughness effect on copper-alumina adhesion

被引：19

作者：

Lim, Ju Dy ^{[1
,2
,3
]}

Susan, Yeow Su Yi ^{[2
]}

Daniel, Rhee MinWoo ^{[1
]}

Leong, Kam Chew ^{[3
]}

Wong, Chee Cheong ^{[2
]}

机构：

[1] ASTAR, Inst Microelect, Singapore, Singapore

[2] Nanyang Technol Univ, Sch Mat Sci & Engn, Singapore 639798, Singapore

[3] GLOBALFOUNDRIES Singapore Pte Ltd, Singapore 738406, Singapore

来源：

MICROELECTRONICS RELIABILITY | 2013年 / 53卷 / 9-11期

关键词：

Alumina; Copper; Bonding strength; Surface roughness; Surface area; IMPROVEMENT; PLASMA;

D O I：

10.1016/j.microrel.2013.07.016

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studied using Atomic Force Microscopy (AFM). With rougher surface, the adhesive strength between a deposited copper film and the alumina substrate is higher due to the larger contact area at the interface. For 99.99% pure copper-96% pure alumina, this effect can account for an adhesive strength increment of more than 50%. (C) 2013 Elsevier Ltd. All rights reserved.

引用

页码：1548 / 1552

页数：5

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