Prediction of Signal Transfer Characteristics of Probe Card Using Electro-Magnetic Solvers

被引：0

作者：

Kim, Hak-jun ^{[1
]}

Yu, Jin-keon ^{[1
]}

Kim, Jongmin ^{[1
]}

Oh, Jung-bea ^{[2
]}

Lim, Hyung-do ^{[2
]}

Nah, Wansoo ^{[1
]}

机构：

[1] Sungkyunkwan Univ, Sch Informat & Commun Engn, 300 Chenchen Dong, Suwon 440746, South Korea

[2] SECRON Co Ltd, Cheonan 330200, South Korea

来源：

ISAPE 2008: THE 8TH INTERNATIONAL SYMPOSIUM ON ANTENNAS, PROPAGATION AND EM THEORY, PROCEEDINGS, VOLS 1-3 | 2008年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Probe card is an interface to test the operation of fabricated semiconductor wafer. It connects the test/measurement device to semiconductor wafer by redistributing thousands of signal routes in an appropriate way. In this paper, we measure and simulate the high-frequency transfer characteristics of a MEMs type Probe Card. By comparison of the simulated and measured data, it is confirmed that Electro-Magnetic Solvers (HFSS, SIwave, and Nexxim for integration) are reliable to predict the high frequency signal transfer characteristics of the complicated MEMs probe card. Also, it was found that the major signal attenuation occurred at the tip and PCB in the Probe Card, especially in high-frequency range.

引用

页码：919 / +

页数：2

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