Influence of Cr alloying on the oxidation resistance of Sn-8Zn-3Bi solders

被引：13
|
作者：
Huang, Na [1 ]
Hu, Anmin [1 ]
Li, Ming [1 ]
Mao, Dali [1 ]
机构：
[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, Key Lab Thin Film & Microfabricat Technol, State Key Lab Met Matrix Composites,Minist Educ, Shanghai 200240, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2013年 / 24卷 / 08期
基金：
中国国家自然科学基金;
关键词：
LEAD-FREE SOLDER; SN-ZN SOLDERS; INTERFACIAL REACTIONS; TEMPERATURE; CU; SYSTEM; RELIABILITY; BEHAVIOR; ELEMENTS; JOINTS;
D O I：
10.1007/s10854-013-1175-5
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Influence of Cr alloying on the oxidation behavior of Sn-8Zn-3Bi-xCr (SZBxCr) (x = 0, 0.1, 0.3, 0.5) solders under 250 A degrees C has been investigated. It was found that the poor oxidation resistance of the solders is attributed to the oxidation of Zn-rich phase and other Zn atoms which diffused to the beta-Sn matrix grain boundaries which form ZnO. With Cr addition, two types of Sn-Zn-Cr phases, along the grain boundaries of beta-Sn matrix and across the Zn-rich phase, were detected in Cr-bearing solder alloys, which prevent the oxygen from diffusing into the bulk of the solder, and the SZB0.3Cr alloy had the best oxidation resistance.
引用
收藏
页码：2812 / 2817
页数：6
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