Cu-In-Microbumps for Low-Temperature Bonding of Fine-Pitch-Interconnects

被引：2
|
作者：
Bickel, Steffen [1 ]
Panchenko, Iuliana [1 ,2 ]
Meyer, Joerg [1 ]
Wahrmund, Wieland [2 ]
Wolf, M. Juergen [2 ]
Neumann, Volker [3 ]
机构：
[1] Tech Univ Dresden, Inst Elect Packaging Technol, D-01062 Dresden, Germany
[2] Fraunhofer Inst Reliabil & Microintegrat IZM, ASSID, Ringstr 12, D-01468 Moritzburg, Germany
[3] Tech Univ Dresden, Inst Semicond & Microsyst, D-01062 Dresden, Germany
来源：
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017) | 2017年
关键词：
SLID; low-temperture-bonding; Indium; 3D integration; FREE SOLDERS;
D O I：
10.1109/ECTC.2017.206
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The advancing heterogeneous integration of various electronic components into a single package requires in particular further development of bonding technologies towards lower temperatures. In our present study, we show the successful joining of dies consisting of Cu-microbumps with In solder caps. Stable interconnections were achieved at a bonding temperature of 180 degrees C in 2 min by solid-liquid-interdiffusion (SLID).
引用
收藏
页码：2092 / 2096
页数：5
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