Development of Ultra-precision Grinder for 300mm Wafers

被引：1

作者：

Zhu, X. L. ^{[1
]}

Dong, Z. G. ^{[1
]}

Kang, R. K. ^{[1
]}

Guo, D. M. ^{[1
]}

机构：

[1] Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China

来源：

ADVANCES IN ABRASIVE TECHNOLOGY XV | 2012年 / 565卷

关键词：

Wafer grinder; Precision grinding; Silicon wafer; Design; On-line monitoring;

D O I：

10.4028/www.scientific.net/AMR.565.609

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

This study presents design of an ultra-precision wafer grinder which incorporates state-of-the-art automatic supervision and control system. The wafer grinder is characterized by wafer surface shape control, grinding forces and wafer thickness monitoring systems. The design provides a totally integrated solution to the ultra-precision grinder that is capable of grinding silicon wafers with surface roughness Ra<3 nm and total thickness variation<2 mu m/300mm.

引用

页码：609 / 614

页数：6

共 50 条

[1] 300mm Prime and the prospect for 450mm wafers
Jones, Scotten W.
[J]. SOLID STATE TECHNOLOGY, 2009, 52 (12) : 14 - 15
[2] High-precision volume manufacturing of optical interference filters on 300mm wafers
Mingels, Stephan
Stapp, Martin
Schmauder, Torsten
Kutty, Navas
Hagedorn, Harro
[J]. ADVANCES IN OPTICAL THIN FILMS VIII, 2024, 13020
[3] Extrusion coating considered applicable to 300mm wafers
不详
[J]. SOLID STATE TECHNOLOGY, 2000, 43 (06) : 44 - 44
[4] Plasma doping system for 200 and 300mm wafers
Liebert, RB
Walther, SR
Felch, SB
Fang, ZW
Pedersen, BO
Hacker, D
[J]. 2000 INTERNATIONAL CONFERENCE ON ION IMPLANTATION TECHNOLOGY, PROCEEDINGS, 2000, : 472 - 475
[5] SEZ's thinner, stronger 300mm wafers
不详
[J]. SOLID STATE TECHNOLOGY, 2001, 44 (02) : 54 - 54
[6] LARGER WAFERS COMING, PROBABLY IN 300MM SIZE
DUNN, PN
[J]. SOLID STATE TECHNOLOGY, 1994, 37 (04) : 24 - &
[7] 300mm wafers: Reclaimer's role and challenges
Thomson, C
Mynster, H
[J]. SOLID STATE TECHNOLOGY, 1999, 42 (08) : 40 - +
[8] Wafer Geometry Technique for Blank 300mm Silicon Wafers
Trujillo-Sevilla, Juan M.
Roque-Velasco, Alex
Jesus Sicilia, Miguel
Casanova-Gonzalez, Oscar
Manuel Ramos-Rodriguez, Jose
Gaudestad, Jan
[J]. 2022 33RD ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2022,
[9] 300mm wafers could give Taiwan world lead
不详
[J]. ELECTRONICS WORLD, 2001, 107 (1777): : 6 - 6
[10] Impact of filtering on nanotopography measurement of 300mm silicon wafers
Riedel, F
Gerber, HA
Wagner, P
[J]. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2002, 5 (4-5) : 465 - 472

← 1 2 3 4 5 →