Contactless interconnection methods - Capacitively coupled interconnection in mobile devices

被引:0
|
作者
Jussila, Aarno [1 ]
Takaneva, Jussi [1 ]
机构
[1] Nokia Electr Ltd, Devices R&D, Tampere, Finland
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Contactless interconnection methods are studied as possible alternatives for galvanic interconnection in mobile devices. This is due to ever-increasing requirements for the connector size and bandwidth. Capacitively coupled interconnection is implemented on a PCB level and signal transmission with pulse signaling is demonstrated for 1 MHz, 10 MHz and 40 MHz PRBS signals. Different schemes for signal transmission through a capacitive interconnection are discussed and their potential benefits are evaluated.
引用
收藏
页码:6 / 9
页数:4
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