Will monolithic 3D IC technology become a real competitor to 3DIC with TSV?

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作者：
Garrou, Phil
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SOLID STATE TECHNOLOGY | 2014年 / 57卷 / 01期
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TM [电工技术]; TN [电子技术、通信技术];
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0808 ; 0809 ;
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页码：9 / 9
页数：1
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