TSV inspection in 3D advanced packaging applications

被引：0
|
作者：
Asgari, Reza [1 ]
机构：
[1] Rudolph Technol Inc, Flanders, NJ USA
来源：
SOLID STATE TECHNOLOGY | 2012年 / 55卷 / 05期
关键词：
Copper;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：24 / +
页数：3
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