Comparison of spreading behaviour and interfacial microstructure in Sn-0.7Cu, Sn-0.3Ag-0.7Cu and Sn-2.5Ag-0.5Cu lead free solder alloys on Fe-42Ni substrate (vol 29, pg 464, 2013)

被引：0
|
作者：
Satyanarayan
Prabhu, K. N.
机构：
来源：
MATERIALS SCIENCE AND TECHNOLOGY | 2013年 / 29卷 / 05期
关键词：
D O I：
10.1179/0267083613Z.000000000397
中图分类号：
T [工业技术];
学科分类号：
08 ;
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页码：636 / 636
页数：1
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