Modeling and Analysis of Transmission Performance of Bonding Wire Interconnection

被引：0
|
作者：
Zuo, Panpan [1 ]
Wang, Mengjun [1 ]
Li, Hongbin [1 ]
Song, Tao [1 ]
Liu, Jianying [1 ]
Li, Er-Ping [2 ]
机构：
[1] Hebei Univ Technol, Sch Elect & Informat Engn, Tianjin, Peoples R China
[2] Zhejiang Univ, Hangzhou, Zhejiang, Peoples R China
来源：
2016 IEEE MTT-S INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC AND MULTIPHYSICS MODELING AND OPTIMIZATION (NEMO) | 2016年
关键词：
Bonding wire; numerical modeling; simulation; scattering parameter;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Novel analytical model for bonding wire has been proposed in this paper. Bonding wires on stacked dies with different connection paths have been modeled and simulated at high frequency. Return loss demonstrated that the transfer connection path showed better transmission performance. Furthermore, the relationship between materials with different dielectric constant and return loss were investigated. Results can help form a good guide for the package design.
引用
收藏
页数：2
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