Investigation of the Dynamics of Liquid Cooling of 3D ICs

被引：0
|
作者：
Islam, Sakib [1 ]
Motaleb, Ibrahim Abdel [1 ]
机构：
[1] Northern Illinois Univ, Dept Elect Engn, De Kalb, IL 60115 USA
来源：
2019 8TH INTERNATIONAL SYMPOSIUM ON NEXT GENERATION ELECTRONICS (ISNE) | 2019年
关键词：
3D-IC; Liquid Cooling; COMSOL; Heat transfer; Thermal analysis;
D O I：
10.1109/isne.2019.8896425
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Although 3D IC technology can provide very high integration density, they suffer from having hotspots that may reach 1000's of degrees. To manage this heat, it is necessary to study the dynamics of cooling and thermal behavior of the ICs. In this study, we report on the dynamics of microchannel liquid cooling using water, R22, and liquid nitrogen. The study shows that using diamond cooling blocks ensures normal operating temperature of 60 degrees C or less, using any of the above coolants. Using SiO2 blocks, only liquid nitrogen can provide acceptable operating temperatures. The study shows also that liquid latent energy and inlet velocity play a major role in the cooling dynamics.
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页数：3
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