Investigating effect of unfilled underfills on board level solder joint reliability of area array packages under drop test and thermal cycling test

被引：0
|
作者：
Ibe, ES [1 ]
Loh, KI [1 ]
Luan, JE [1 ]
Tee, TY [1 ]
机构：
[1] Zymet Inc, E Hanover, NJ 07396 USA
来源：
PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2 | 2005年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The work reported here explores the effect of underfill encapsulants on drop test and thermal cycle reliability of area array packages, such as BGA's, CSP's, and WL-CSP's. An unfilled underfill was found to provide superior drop test performance. Silica filled underfill, with lower CTE, was found to provide superior thermal cycle performance. However, if the unfilled underfill provides adequate thermal cycle performance, its use yields substantial process benefits.
引用
收藏
页码：579 / 583
页数：5
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