Surface-Tension Driven Self-Assembly for VCSEL Chip Bonding to Achieve 3D and Hetero Integration

被引：0

作者：

Ito, Y. ^{[1
,2
]}

Fukushima, T. ^{[3
]}

Lee, K. -W. ^{[3
]}

Choki, K. ^{[2
]}

Tanaka, T. ^{[1
,4
]}

Koyanagi, M. ^{[3
]}

机构：

[1] Tohoku Univ, Grad Sch Engn, Aoba Ku, Sendai, Miyagi 9808579, Japan

[2] Sumitomo Bakelite Co Ltd, Utsunomiya, Tochigi 3213231, Japan

[3] Tohoku Univ, New Ind Creat Hatchery Ctr NICHe, Aoba Ku, Sendai, Miyagi 9808579, Japan

[4] Tohoku Univ, Grad Sch Biomed Engn, Aoba Ku, Sendai, Miyagi 9808579, Japan

来源：

2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2014年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Self-assembly with liquid surface tension was applied to tiny chips that were difficult to manipulate. Dummy chips that mimics VCSEL were aligned toward hydrophilic sites surrounding a hydrophobic area on an Si interposer. The alignment accuracies were 0 and -2.0 mu m in X and Y directions.

引用

页码：15 / 15

页数：1

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