Surface-Tension Driven Self-Assembly for VCSEL Chip Bonding to Achieve 3D and Hetero Integration

被引：0

作者：

Ito, Y. ^{[1
,2
]}

Fukushima, T. ^{[3
]}

Lee, K. -W. ^{[3
]}

Choki, K. ^{[2
]}

Tanaka, T. ^{[1
,4
]}

Koyanagi, M. ^{[3
]}

机构：

[1] Tohoku Univ, Grad Sch Engn, Aoba Ku, Sendai, Miyagi 9808579, Japan

[2] Sumitomo Bakelite Co Ltd, Utsunomiya, Tochigi 3213231, Japan

[3] Tohoku Univ, New Ind Creat Hatchery Ctr NICHe, Aoba Ku, Sendai, Miyagi 9808579, Japan

[4] Tohoku Univ, Grad Sch Biomed Engn, Aoba Ku, Sendai, Miyagi 9808579, Japan

来源：

2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2014年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Self-assembly with liquid surface tension was applied to tiny chips that were difficult to manipulate. Dummy chips that mimics VCSEL were aligned toward hydrophilic sites surrounding a hydrophobic area on an Si interposer. The alignment accuracies were 0 and -2.0 mu m in X and Y directions.

引用

页码：15 / 15

页数：1

共 50 条

[11] Liquid Surface Tension-Driven Chip Self-Assembly Technology with Cu-Cu Hybrid Bonding for High-Precision and High-Throughput 3D Stacking of DRAM
Zehua, Du
Kikuchi, Hiroshi
Hishinuma, Hayato
Murugesan, Mariappan
Tanaka, Tetsu
Fukushima, Takafumi
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024, 2024, : 1335 - 1341
[12] SELF-ASSEMBLY OF 3-DIMENSIONAL MICROSTRUCTURES USING ROTATION BY SURFACE-TENSION FORCES
SYMS, RRA
YEATMAN, EM
ELECTRONICS LETTERS, 1993, 29 (08) : 662 - 664
[13] Surface-tension driven self-assembly of microchips on hydrophobic receptor sites with water using forced wetting
Chang, Bo
Shah, Ali
Routa, Iiris
Lipsanen, Harri
Zhou, Quan
APPLIED PHYSICS LETTERS, 2012, 101 (11)
[14] Study of Self-Assembly Technology for 3D Integration Applications
Chang, Hsiao-Chun
Fan, Cheng-Han
Chou, Yi-Chia
Chen, Kuan-Neng
2015 10TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2015, : 237 - 240
[15] Heterogeneous 3-D Integration Using Self-Assembly and Electrostatic Bonding
Koyanagi, Mitsumasa
Fukushima, Takafumi
Lee, Kang-Wook
Tanaka, Tetsu
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2016, 6 (07): : 1002 - 1008
[16] Capillary Self-Assembly for 3D Heterogeneous System Integration and Packaging
Yuka Ito
Takafumi Fukushima
Kang-Wook Lee
Tetsu Tanaka
Mitsumasa Koyanagi
MRS Advances, 2016, 1 (34) : 2355 - 2366
[17] Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly
Fukushima, Takafumi
2020 IEEE ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM 2020), 2020,
[18] Plasma Assisted Multichip-to-Wafer Direct Bonding Technology for Self-Assembly Based 3D Integration
Hashiguchi, H.
Yonekura, H.
Fukushima, T.
Murugesan, M.
Kino, H.
Lee, K. -W.
Tanaka, T.
Koyanagi, M.
2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 1458 - 1463
[19] Self-Assembly Technologies with High-Precision Chip Alignment and Fine-Pitch Microbump Bonding for Advanced Die-to-Wafer 3D Integration
Fukushima, T.
Ohara, Y.
Murugesan, M.
Bea, J. -C.
Lee, K. -W.
Tanaka, T.
Koyanagi, M.
2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 2050 - 2055
[20] Self-Assembly Technology for Reconfigured Wafer-to-Wafer 3D Integration
Fukushima, T.
Iwata, E.
Lee, K. -W.
Tanaka, T.
Koyanagi, M.
2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 1050 - 1055

← 1 2 3 4 5 →