An Embrittlement Mechanism of Impact Fracture of Sn-Ag-Cu Solder Joints on BGA Using Electroplated Ni/Au Surface Finishes

被引：4

作者：

Yamamoto, Kenichi ^{[1
]}

Akahoshi, Haruo ^{[2
]}

Kato, Takahiko ^{[3
]}

Kawamura, Toshinori ^{[3
]}

Koizumi, Masahiro ^{[3
]}

Satoh, Ryohel ^{[4
]}

机构：

[1] Renesas Technol Corp, Jisso & Test Technol Dev Div, Tokyo 1878588, Japan

[2] Hitachi Ltd, Hitachi Res Lab, Ibaraki 3191292, Japan

[3] Hitachi Ltd, Mat Res Lab, Ibaraki 3191292, Japan

[4] Osaka Univ, Ctr Adv Sci & Innovat, Suita, Osaka 5650871, Japan

来源：

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2008年 / 31卷 / 04期

关键词：

Ball grid array (BGA); electroplated Ni/Au; impact load; intermetallic compound; lead-free solder; Sn-Ag-Cu; solder mask;

D O I：

10.1109/TCAPT.2008.2004962

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The impact toughness evaluation and fracture mechanism analysis in board level of Sn-3mass%Ag-0.5mass%Cu solder joints of ball grid arrays (BGAs) using electrolysis Ni/Au plating were performed. The cause of impact toughness degradation of BGA solder ball joints is the segregation of impurities to the (Cu, Ni)(6)Sn-5 intermetallic compound grain boundary formed in the solder joints. The impurities, consisting of Cl and organic matters, are taken in the Ni plating film at the time of Ni plating. The organic matter impurities come primarily from the solder mask of the BGA interposer substrates. To improve the impact toughness of the Sn-3mass%Ag-0.5mass%Cu solder joint of the BGA, it is necessary, to lower the concentration of these impurities. This, in turn, places importance on solder mask material selection (to minimize Ni plating bath contamination) as well as contamination prevention and plating bath sanitization.

引用

页码：849 / 858

页数：10

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