Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer Layer Technique for 3D Integration

被引：0
|
作者：
Liang, Hao-Wen [1 ]
Yu, Ting-Yang [1 ]
Chang, Yao-Jen [1 ]
Chen, Kuan-Neng [1 ]
机构：
[1] Natl Chia Tung Univ, Dept Elect Engn, Hsinchu 300, Taiwan
来源：
PROCEEDINGS OF THE 2016 IEEE 23RD INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA) | 2016年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Wafer-level Sn/In-Cu bonding structure with Ni ultra-thin buffer layer is investigated to achieve a reduction in solder thickness, bonding temperature and duration. Furthermore, the asymmetric bonding structure is able to separate the manufacturing process of solder and electrical isolation layer. It is a promising approach for the application on hybrid bonding of three-dimensional integration.
引用
收藏
页码：312 / 315
页数：4
相关论文
共 50 条
  • [41] Fabrication and simulation of novel ultra-thin 3D silicon detectors
    Pellegrini, G.
    Garcia, F.
    Balbuena, J.
    Cabruja, E.
    Lozano, M.
    Orava, R.
    Ullan, M.
    [J]. NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 2009, 604 (1-2): : 115 - 118
  • [42] Design and Demonstration of Ultra-thin Glass 3D IPD Diplexers
    Wu, Zihan
    Min, Junki
    Kim, Minsuk
    Pulugurtha, Markondeya Raj
    Sundaram, Venky
    Tummala, Rao R.
    [J]. 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 2348 - 2352
  • [43] Light propagation in ultra-thin gap in 3D photonic crystals
    Kitano, K.
    Ishizaki, K.
    Gondaira, K.
    Tanaka, Y.
    Noda, S.
    [J]. PHOTONICS AND NANOSTRUCTURES-FUNDAMENTALS AND APPLICATIONS, 2017, 24 : 58 - 62
  • [44] Ultra-thin QFN-Like 3D Package with 3D Integrated Passive Devices
    Ghannam, Ayad
    van Haare, Niek
    Bravin, Julian
    Brandl, Elisabeth
    Brandstatter, Birgit
    Klingler, Hannes
    Auer, Benedikt
    Meunier, Philippe
    Kersjes, Sebastiaan
    [J]. 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 1789 - 1795
  • [45] Low Temperature Wafer Bonding for 3D Applications
    Burggraf, J.
    Bravin, J.
    Wiesbauer, H.
    Dragoi, V.
    [J]. PROCESSING, MATERIALS, AND INTEGRATION OF DAMASCENE AND 3D INTERCONNECTS 5, 2014, 58 (17): : 67 - 73
  • [46] An Ultra-Fast Temporary Bonding and Release Process Based on Thin Photolysis Polymer in 3D Integration
    Tsai, Tsung-Yen
    Lin, Chien-Hung
    Lee, Chia-Lin
    Yang, Shan-Chun
    Chen, Kuan-Neng
    [J]. 2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015), 2015,
  • [47] Low Temperature Cu nanorod/Sn/Cu nanorod Bonding Technology for 3D Integration
    Du, Li
    Shi, Tielin
    Tang, Zirong
    Shen, Junjie
    Liao, Guanglan
    [J]. 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 951 - 956
  • [48] Low Temperature Direct Bonding 3D Stacking Technologies for High Density Device Integration
    Di Cioccio, L.
    Radu, I.
    Gaudin, G.
    Lacave, T.
    Baudin, F.
    Sadaka, M.
    Signamarcheix, T.
    [J]. ULSI PROCESS INTEGRATION 8, 2013, 58 (09): : 17 - 28
  • [49] SoIC for Low-Temperature, Multi-Layer 3D Memory Integration
    Chen, M. F.
    Lin, C. S.
    Liao, E. B.
    Chiou, W. C.
    Kuo, C. C.
    Hu, C. C.
    Tsai, C. H.
    Wang, C. T.
    Yu, Douglas
    [J]. 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 855 - 860
  • [50] Electronic structure and magnetic behavior of ultra-thin Fe films grown on W(110) with a Co buffer layer
    Calloni, A.
    Jagadeesh, M. S.
    Zani, M.
    Duo, L.
    Ciccacci, F.
    Bussetti, G.
    [J]. JOURNAL OF ELECTRON SPECTROSCOPY AND RELATED PHENOMENA, 2020, 243 (243)
12345