Ultra Wideband 3D Interconnects using Aerosol Jet Printing up to 110 GHz

被引：0

作者：

Qayyum, Jubaid Abdul ^{[1
]}

Abt, Marvin ^{[2
]}

Roch, Aljoscha ^{[2
]}

Ulusoy, Ahmet Cagri ^{[1
]}

Papapolymerou, John ^{[1
]}

机构：

[1] Michigan State Univ, Dept Elect & Comp Engn, E Lansing, MI 48824 USA

[2] Fraunhofer USA Ctr Coatings & Diamond Technol CCD, E Lansing, MI USA

来源：

2017 47TH EUROPEAN MICROWAVE CONFERENCE (EUMC) | 2017年

基金：

美国国家科学基金会;

关键词：

Aerosol jet printing (AJP); Interconnects; coplanar waveguide (CPW); 3D printing; system-on-package (SoP); millimeter-wave; CHIP;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, the authors present proof of concept 3D printed interconnects fabricated using aerosol jet printing (AJP) technology. A trapezoidal structure was 3D printed on Liquid Crystal Polymer (LCP) and Coplanar Waveguides (CPW) were printed on top of them to imitate mm-wave packaging. The printing was done using silver nanoparticle ink that acquired 40% conductivity of the bulk silver after sintering at 200 C for one hour. Scattering Parameters (S-parameters) were simulated and measured from 1 GHz to 110 GHz. The CPW interconnects yielded insertion loss of as low as 0.49 dB/mm including the trapezoid, and with a loss of 0.38 dB/mm on LCP substrate at 110 GHz. This work represents AJP as a solution for cost-effective system-on-package (SoP)/millimeter-wave (mm-wave) systems.

引用

页码：1112 / 1115

页数：4

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