Ultra Wideband 3D Interconnects using Aerosol Jet Printing up to 110 GHz

被引:0
|
作者
Qayyum, Jubaid Abdul [1 ]
Abt, Marvin [2 ]
Roch, Aljoscha [2 ]
Ulusoy, Ahmet Cagri [1 ]
Papapolymerou, John [1 ]
机构
[1] Michigan State Univ, Dept Elect & Comp Engn, E Lansing, MI 48824 USA
[2] Fraunhofer USA Ctr Coatings & Diamond Technol CCD, E Lansing, MI USA
基金
美国国家科学基金会;
关键词
Aerosol jet printing (AJP); Interconnects; coplanar waveguide (CPW); 3D printing; system-on-package (SoP); millimeter-wave; CHIP;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, the authors present proof of concept 3D printed interconnects fabricated using aerosol jet printing (AJP) technology. A trapezoidal structure was 3D printed on Liquid Crystal Polymer (LCP) and Coplanar Waveguides (CPW) were printed on top of them to imitate mm-wave packaging. The printing was done using silver nanoparticle ink that acquired 40% conductivity of the bulk silver after sintering at 200 C for one hour. Scattering Parameters (S-parameters) were simulated and measured from 1 GHz to 110 GHz. The CPW interconnects yielded insertion loss of as low as 0.49 dB/mm including the trapezoid, and with a loss of 0.38 dB/mm on LCP substrate at 110 GHz. This work represents AJP as a solution for cost-effective system-on-package (SoP)/millimeter-wave (mm-wave) systems.
引用
收藏
页码:1112 / 1115
页数:4
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