Ultra Wideband 3D Interconnects using Aerosol Jet Printing up to 110 GHz

被引：0
|
作者：
Qayyum, Jubaid Abdul [1 ]
Abt, Marvin [2 ]
Roch, Aljoscha [2 ]
Ulusoy, Ahmet Cagri [1 ]
Papapolymerou, John [1 ]
机构：
[1] Michigan State Univ, Dept Elect & Comp Engn, E Lansing, MI 48824 USA
[2] Fraunhofer USA Ctr Coatings & Diamond Technol CCD, E Lansing, MI USA
来源：
2017 47TH EUROPEAN MICROWAVE CONFERENCE (EUMC) | 2017年
基金：
美国国家科学基金会;
关键词：
Aerosol jet printing (AJP); Interconnects; coplanar waveguide (CPW); 3D printing; system-on-package (SoP); millimeter-wave; CHIP;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, the authors present proof of concept 3D printed interconnects fabricated using aerosol jet printing (AJP) technology. A trapezoidal structure was 3D printed on Liquid Crystal Polymer (LCP) and Coplanar Waveguides (CPW) were printed on top of them to imitate mm-wave packaging. The printing was done using silver nanoparticle ink that acquired 40% conductivity of the bulk silver after sintering at 200 C for one hour. Scattering Parameters (S-parameters) were simulated and measured from 1 GHz to 110 GHz. The CPW interconnects yielded insertion loss of as low as 0.49 dB/mm including the trapezoid, and with a loss of 0.38 dB/mm on LCP substrate at 110 GHz. This work represents AJP as a solution for cost-effective system-on-package (SoP)/millimeter-wave (mm-wave) systems.
引用
收藏
页码：1112 / 1115
页数：4
相关论文
共 50 条
  • [1] Ultra Wideband 3D Interconnects using Aerosol Jet Printing up to 110 GHz
    Qayyum, Jubaid Abdul
    Abt, Marvin
    Roch, Aljoscha
    Ulusoy, Ahmet Cagri
    Papapolymerou, John
    2017 12TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC), 2017, : 372 - 375
  • [2] 3D Electrochemical Sensor and Microstructuration Using Aerosol Jet Printing
    Fapanni, Tiziano
    Sardini, Emilio
    Serpelloni, Mauro
    Tonello, Sarah
    SENSORS, 2021, 21 (23)
  • [3] 3D Aerosol Jet printing for microelectronics applications
    Hedges, Martin
    Marin, Aaron Borras
    Advancing Microelectronics, 2014, 41 (02): : 26 - 30
  • [4] 3D Aerosol Jet® printing for microstructuring: Advantages and Limitations
    Seiti, Miriam
    Degryse, Olivier
    Ferraro, Rosalba Monica
    Giliani, Silvia
    Bloemen, Veerle
    Ferraris, Eleonora
    INTERNATIONAL JOURNAL OF BIOPRINTING, 2023, 9 (06) : 57 - 74
  • [5] Ultra-Wideband Transmission Lines on Complex Structures via Extendable Aerosol Jet 3D-Printing
    Konstantinou, Xenofon
    Craton, Michael Thomas
    Albrecht, John D.
    Papapolymerou, John
    2021 IEEE INTERNATIONAL CONFERENCE ON MICROWAVES, ANTENNAS, COMMUNICATIONS AND ELECTRONIC SYSTEMS (COMCAS), 2021, : 103 - 106
  • [6] Conformal printing of sensors on 3D and flexible surfaces using Aerosol Jet deposition
    Blumenthal, Tyler
    Fratello, Vincent
    Nino, Giovanni
    Ritala, Keith
    NANOSENSORS, BIOSENSORS, AND INFO-TECH SENSORS AND SYSTEMS 2013, 2013, 8691
  • [7] Aerosol Jet® printing 3D capabilities for metal and polymeric inks
    Seiti M.
    Degryse O.
    Ferraris E.
    Materials Today: Proceedings, 2022, 70 : 38 - 44
  • [8] Ultra-Wideband Hybrid Substrate Integrated Ribbon Waveguides Using 3D Printing
    Byford, Jennifer A.
    Chahal, Premjeet
    2016 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2016,
  • [9] Aerosol Jet Printing of 3D Pillar Arrays from Photopolymer Ink
    Vlnieska, Vitor
    Gilshtein, Evgeniia
    Kunka, Danays
    Heier, Jakob
    Romanyuk, Yaroslav E.
    POLYMERS, 2022, 14 (16)
  • [10] Precursor development of iron nanopowders for nanoink Aerosol Jet 3D printing
    Perales, Diana
    Boyle, Timothy
    Bell, Nelson
    Cook, Adam
    Treadwell, LaRico
    Reinholtz, Derek
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2018, 255
12345