Gallium alloy interconnects for flip-chip assembly applications

被引：2
|
作者：
Baldwin, DF [1 ]
Deshmukh, RD [1 ]
Hau, CS [1 ]
机构：
[1] GEORGIA INST TECHNOL,GEORGE W WOODRUFF SCH MECH ENGN,ATLANTA,GA 30332
来源：
46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS | 1996年
关键词：
D O I：
10.1109/ECTC.1996.550881
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：1143 / 1150
页数：4
相关论文
共 50 条
  • [21] Compliant cantilevered spring interconnects for flip-chip packaging
    Ma, LY
    Zhu, Q
    Sitaraman, SK
    Chua, C
    Fork, DK
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 761 - 766
  • [22] Nanocomposite underfills for flip-chip applications
    Gross, K
    Hackett, S
    Schultz, W
    Thompson, W
    Zhang, ZQ
    Fan, LH
    Wong, CP
    53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 951 - 956
  • [23] Microspring Characterization and Flip-Chip Assembly Reliability
    Cheng, Bowen
    De Bruyker, Dirk
    Chua, Chris
    Sahasrabuddhe, Kunal
    Shubin, Ivan
    Cunningham, John E.
    Luo, Ying
    Boehringer, Karl F.
    Krishnamoorthy, Ashok V.
    Chow, Eugene M.
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2013, 3 (02): : 187 - 196
  • [24] Flip-chip on organic carrier assembly evaluation
    Banks, DR
    Bahe, SM
    Holcomb, MD
    Le-Huu, DK
    PAN PACIFIC MICROELECTRONICS SYMPOSIUM, 2001, PROCEEDINGS, 2001, : 230 - 234
  • [25] Indium bumps investigation for the flip-chip assembly
    Biktashov, Aidar M.
    Kuzmin, Nikolai B.
    Paulish, Andrei G.
    EDM 2006: 7TH ANNUAL INTERNATIONAL WORKSHOP AND TUTORIALS ON ELECTRON DEVICES AND MATERIALS, PROCEEDINGS, 2006, : 35 - +
  • [26] COMPLIANT BUMPS FOR ADHESIVE FLIP-CHIP ASSEMBLY
    KESWICK, K
    GERMAN, RL
    BREEN, M
    NOLAN, R
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (03): : 503 - 510
  • [27] STUDIES OF THERMOSONIC BONDING FOR FLIP-CHIP ASSEMBLY
    KANG, SY
    WILLIAMS, PM
    MCLAREN, TS
    LEE, YC
    MATERIALS CHEMISTRY AND PHYSICS, 1995, 42 (01) : 31 - 37
  • [28] High accuracy flip-chip assembly of MOEMS
    Quirke, C
    Lecarpentier, G
    PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, : 226 - 230
  • [29] Modelling technology to predict flip-chip assembly
    Wheeler, D
    Bailey, C
    ITHERM 2000: SEVENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOL 2, PROCEEDINGS, 2000, : 79 - 85
  • [30] Micromirror arrays fabricated by flip-chip assembly
    Michalicek, MA
    Zhang, WG
    Harsh, KF
    Bright, VM
    Lee, YC
    MINIATURIZED SYSTEMS WITH MICRO-OPTICS AND MEMS, 1999, 3878 : 68 - 79
12345