Gallium alloy interconnects for flip-chip assembly applications

被引：2
|
作者：
Baldwin, DF [1 ]
Deshmukh, RD [1 ]
Hau, CS [1 ]
机构：
[1] GEORGIA INST TECHNOL,GEORGE W WOODRUFF SCH MECH ENGN,ATLANTA,GA 30332
来源：
46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS | 1996年
关键词：
D O I：
10.1109/ECTC.1996.550881
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：1143 / 1150
页数：4
相关论文
共 50 条
  • [11] Anisotropic conductive adhesives for flip-chip interconnects
    Wang, Weiqiang
    Chan, Y. C.
    Pecht, Michael
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2008, 22 (8-9) : 871 - 892
  • [12] Evaluation of wirebond and flip-chip interconnects of a leadless plastic package for RF applications
    Engl, M
    Pressel, K
    Theuss, H
    Dangelmaier, J
    Eurskens, W
    Knapp, H
    Simbuerger, W
    Weigel, R
    PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, : 304 - 308
  • [13] Processing mechanics for flip-chip assembly
    Wang, JJ
    Qian, ZF
    Liu, S
    MICROELECTRONIC PACKAGING AND LASER PROCESSING, 1997, 3184 : 22 - 29
  • [14] Flip-chip assembly for photonic circuits
    Wörhoff, K
    Heideman, RG
    Gilde, MJ
    Blidegn, K
    Heschel, M
    van den Vlekkert, H
    MICRO-OPTICS: FABRICATION, PACKAGING, AND INTEGRATION, 2004, 5454 : 9 - 20
  • [15] Double bump flip-chip assembly
    Yan, Kathy Wei
    Johnson, R. Wayne
    Stapleton, Russell
    Ghosh, Kalyan
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2006, 29 (02): : 119 - 133
  • [16] Damage evolution and mechanical failure in flip-chip interconnects
    Soper, A
    De Wolf, I
    Pozza, G
    Ignat, M
    Parat, G
    ELECTRONIC PACKAGING MATERIALS SCIENCE X, 1998, 515 : 105 - 110
  • [17] Flip-chip interconnects for frequencies up to W band
    Heinrich, W
    Jentzsch, A
    Richter, H
    ELECTRONICS LETTERS, 2001, 37 (03) : 180 - 181
  • [18] Pb-free solders for flip-chip interconnects
    D. R. Frear
    J. W. Jang
    J. K. Lin
    C. Zhang
    JOM, 2001, 53 : 28 - 33
  • [19] Pb-free solders for flip-chip interconnects
    Frear, DR
    Jang, JW
    Lin, JK
    Zhang, C
    JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 2001, 53 (06): : 28 - +
  • [20] Flip-Chip Approach for 500 GHz Broadband Interconnects
    Sinha, Siddhartha
    Doerner, Ralf
    Schmueckle, Franz-Josef
    Monayakul, Sirinpa
    Hrobak, Michael
    Weimann, Nils G.
    Krozer, Viktor
    Heinrich, Wolfgang
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2017, 65 (04) : 1215 - 1225
12345