GaN for power devices: benefits, applications, and normally-off technologies

被引:0
|
作者
Longobardi, G. [1 ,2 ]
机构
[1] Univ Cambridge, Dept Engn, Cambridge, England
[2] Cambridge GaN Devices Ltd, Cambridge, England
关键词
Gallium Nitride (GaN); normally-off technologies; traps; power devices; reliability; DONOR TRAPS; ALGAN/GAN; MISFET;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Gallium Nitride (GaN) based power devices have been demonstrated to deliver higher energy efficiency than their Silicon (Si) counterparts for 200-1.2kV rated applications. The benefits of GaN technologies and their market potential will be highlighted in this paper together with the main challenges that GaN-based power systems need to overcome to reach their full potential and finally enter the market. These challenges include: (i) normally-off operation, (ii) low threshold voltage (iii) high-voltage reliability, and (iv) unstable switching behaviour. A particular focus will be given to the solutions proposed in literature for obtaining the desired normally-off operation and enhanced stability. Finally, measurement results on one of the aspects related to the reliability of the gate of a commercially available normally-off GaN transistor will be discussed.
引用
收藏
页码:11 / 18
页数:8
相关论文
共 50 条
  • [21] Cosmic ray immunity of COTS Normally-Off Power GaN FETs for space, aeronautic and automotive applications
    Zerarka, M.
    Crepel, O.
    Weulersse, C.
    Morand, S.
    Binois, C.
    Mazurek, M.
    Vignon, G.
    Serrano, L.
    Coccetti, F.
    2020 20TH EUROPEAN CONFERENCE ON RADIATION AND ITS EFFECTS ON COMPONENTS AND SYSTEMS (RADECS 2020), 2022, : 206 - 210
  • [22] High Voltage Normally-off GaN MOSC-HEMTs on Silicon Substrates for Power Switching Applications
    Li, Zhongda
    Waldron, John
    Dayal, Rohan
    Parsa, Leila
    Hella, Mona
    Chow, T. Paul
    2012 24TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2012, : 45 - 48
  • [23] Investigation of p-GaN tri-Gate normally-Off GaN Power MOSHEMTs
    Zhu, Minghua
    Ma, Jun
    Matioli, Elison
    PROCEEDINGS OF THE 2020 32ND INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD 2020), 2020, : 345 - 348
  • [24] Impact of the buffer structure on trapping characteristics of normally-off p-GaN/AlGaN/GaN HEMTs for power switching applications
    Tapajna, M.
    Valik, L.
    Kotara, P.
    Zhytnytska, R.
    Brunner, F.
    Hilt, O.
    Bahat-Treidel, E.
    Wuerfl, J.
    Kuzmik, J.
    2014 10TH INTERNATIONAL CONFERENCE ON ADVANCED SEMICONDUCTOR DEVICES & MICROSYSTEMS (ASDAM), 2014, : 121 - 124
  • [25] Design of a normally-off diamond JFET for high power integrated applications
    Donato, N.
    Pagnano, D.
    Napoli, E.
    Longobardi, G.
    Udrea, F.
    DIAMOND AND RELATED MATERIALS, 2017, 78 : 73 - 82
  • [26] Nanofabrication of normally-off GaN vertical nanowire MESFETs
    Doundoulakis, G.
    Adikimenakis, A.
    Stavrinidis, A.
    Tsagaraki, K.
    Androulidaki, M.
    Iacovella, F.
    Deligeorgis, G.
    Konstantinidis, G.
    Georgakilas, A.
    NANOTECHNOLOGY, 2019, 30 (28)
  • [27] Study of Magnesium Activation Effect on Pinch-Off Voltage of Normally-Off p-GaN HEMTs for Power Applications
    Giorgino, Giovanni
    Greco, Giuseppe
    Moschetti, Maurizio
    Miccoli, Cristina
    Castagna, Maria Eloisa
    Tringali, Cristina
    Fiorenza, Patrick
    Roccaforte, Fabrizio
    Iucolano, Ferdinando
    CRYSTALS, 2023, 13 (09)
  • [28] 250 °C operation normally-off GaN MOSFETs
    Niiyama, Yuki
    Kambayashi, Hiroshi
    Ootomo, Shinya
    Nomura, Takehiko
    Yoshida, Seikoh
    SOLID-STATE ELECTRONICS, 2007, 51 (05) : 784 - 787
  • [29] How to quantify and predict long term multiple stress operation: Application to Normally-Off Power GaN transistor technologies
    Bensoussan, A.
    MICROELECTRONICS RELIABILITY, 2016, 58 : 103 - 112
  • [30] Modeling of GaN-Based Normally-Off FinFET
    Yadav, Chandan
    Kushwaha, Pragya
    Khandelwal, Sourabh
    Duarte, Juan Pablo
    Chauhan, Yogesh Singh
    Hu, Chenming
    IEEE ELECTRON DEVICE LETTERS, 2014, 35 (06) : 612 - 614