共 50 条
- [42] A S-band 3D Surface Mount Packaged SiGe and GaN Tx Module using Flip-Chip Bonding and a Device Embedded PCB Substrate 2018 13TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC), 2018, : 285 - 288
- [43] A S-band 3D Surface Mount Packaged SiGe and GaN Tx Module using Flip-Chip Bonding and a Device Embedded PCB Substrate 2018 48TH EUROPEAN MICROWAVE CONFERENCE (EUMC), 2018, : 1253 - 1256
- [44] Compact LNA and VCO 3-D MMICs using commercial GaAsPHEMT technology for V-band single-chip TRX MMIC 2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2002, : 1717 - 1720
- [46] Development of K-band front-end devices for broadband wireless communication systems using millimeter-wave flip-chip IC technology IEICE Trans Electron, 6 (827-833):
- [47] Development of K-Band front-end devices for broadband wireless communication systems using millimeter-wave flip-chip IC technology IEICE TRANSACTIONS ON ELECTRONICS, 1998, E81C (06): : 827 - 833
- [48] Integrated power electronics modules for 400V/10A motor-drive applications using flip-chip flex-circuit technology PESC'03: 2003 IEEE 34TH ANNUAL POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1-4, CONFERENCE PROCEEDINGS, 2003, : 431 - 435
- [49] A Full E-band Low Noise Amplifier Realized by Using Novel Wafer-Level Chip Size Package Technology Suitable for Reliable Flip-chip Reflow-Soldering 2014 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2014,
- [50] 3D Volumetric Ultrasound Imaging with a 32x32 CMUT Array Integrated with Front-End ICs Using Flip-Chip Bonding Technology 2013 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE DIGEST OF TECHNICAL PAPERS (ISSCC), 2013, 56 : 396 - +