New Concept of TSV Formation Methodology Using Directed Self-Assembly (DSA)

被引：0

作者：

Fukushima, Takafumi ^{[1
,2
]}

Murugesan, Mariappan ^{[2
]}

Ohsaki, Shin ^{[2
]}

Hashimoto, Hiroyuki ^{[2
]}

Bea, Jichoel ^{[2
]}

Lee, Kang-Wook ^{[2
]}

Tanaka, Tetsu ^{[1
,3
]}

Koyanagi, Mitsumasa ^{[2
]}

机构：

[1] Tohoku Univ, Grad Sch Engn, Dept Mech Syst Engn, Aoba Ku, 6-6-12 Aza Aoba, Sendai, Miyagi 9808579, Japan

[2] Tohoku Univ, New Ind Creat Hatchery Ctr, Sendai, Miyagi, Japan

[3] Tohoku Univ, Grad Sch Biomed Engn, Dept Biomed Engn, Sendai, Miyagi, Japan

来源：

2016 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) | 2016年

关键词：

Directed Self-Assembly (DSA); 3D Integration Technology; Through-Silicon Via (TSV); Nano metal particles; Self-Consistent Field (SCF) theory; INTEGRATION;

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

A new TSV formation methodology based on advanced Directed Self-Assembly (DSA) with nanocomposites consisting of nano metal particles and block-co-polymers is proposed in this paper. Cylindrical nano-ordered structures are formed in Si deep holes through phase separation of polystyrene-block-poly methyl methacrylate polymers (PS-b-PMMA). The impact of molecular weight of the polymers, composition (PS/PMMA ratio), and phase separation temperature on the morphologies is discussed. In addition, simulation results using Self-Consistent Field (SCF) theory are introduced to make fine-pitch TSV.

引用

页数：4

共 50 条

[1] Directed Self-Assembly (DSA) For Contact Applications
Weng, Ming-Hui
Ko, Tsung-Han
Lee, Chih-Jie
Shen, Han-Ping
Wu, Chieh-Han
Hsieh, Ken-Hsien
Huang, Yuan-Chien
Wu, Cheng-Han
Lee, Chung-Ju
Chang, Ching-Yu
Lin, Chin-Hsiang
ADVANCES IN PATTERNING MATERIALS AND PROCESSES XXXV, 2018, 10586
[2] Defect source analysis of directed self-assembly process (DSA of DSA)
Delgadillo, Paulina Rincon
Harukawa, Ryota
Suri, Mayur
Durant, Stephane
Cross, Andrew
Nagaswami, Venkat R.
Van den Heuvel, Dieter
Gronheid, Roel
Nealey, Paul
ALTERNATIVE LITHOGRAPHIC TECHNOLOGIES V, 2013, 8680
[3] Directed Self-Assembly (DSA) Template Pattern Verification
Xiao, Zigang
Du, Yuelin
Tian, Haitong
Wong, Martin D. F.
Yi, He
Wong, H. -S. Philip
Zhang, Hongbo
2014 51ST ACM/EDAC/IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2014,
[4] Multifunctional hardmask neutral layer for directed self-assembly (DSA) patterning
Guerrero, Douglas J.
Hockey, Mary Ann
Wang, Yubao
Calderas, Eric
ALTERNATIVE LITHOGRAPHIC TECHNOLOGIES V, 2013, 8680
[5] Defectivity Study for Directed Self-Assembly (DSA) Contact Hole Shrink
Ko, Tsung-Han
Lo, Kuan-Hsin
Wu, Chieh-Han
Chang, Ching-Yu
Lee, Chung-Ju
Lin, John
JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, 2016, 29 (06) : 793 - 796
[6] Layout Optimization and Template Pattern Verification for Directed Self-Assembly (DSA)
Xiao, Zigang
Guo, Daifeng
Wong, Martin D. F.
Yi, He
Tung, Maryann C.
Wong, H. -S. Philip
2015 52ND ACM/EDAC/IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2015,
[7] Mask Optimization for Directed Self-Assembly Lithography: Inverse DSA and Inverse Lithography
Shim, Seongbo
Shin, Youngsoo
2016 21ST ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC), 2016, : 83 - 88
[8] Verification of Directed Self-Assembly (DSA) Guide Patterns through Machine Learning
Shim, Seongbo
Cai, Sibo
Yang, Jaewon
Yang, Seunghune
Choi, Byungil
Shin, Youngsoo
ALTERNATIVE LITHOGRAPHIC TECHNOLOGIES VII, 2015, 9423
[9] Pattern Transfer of Directed Self-Assembly (DSA) Patterns for CMOS Device Applications
Tsai, Hsin-Yu
Miyazoe, Hiroyuki
Engelmann, Sebastian
Bangsaruntip, Sarunya
Lauer, Isaac
Bucchignano, Jim
Klaus, Dave
Gignac, Lynne
Joseph, Eric
Cheng, Joy
Sanders, Dan
Guillorn, Michael
ADVANCED ETCH TECHNOLOGY FOR NANOPATTERNING II, 2013, 8685
[10] Directed Self-Assembly
Sanders, Daniel P.
Arnold, William H.
JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2012, 11 (03):

← 1 2 3 4 5 →